Patents by Inventor Ansgar Thorns

Ansgar Thorns has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8062974
    Abstract: Conductions and vias between different, stacked metallic layers of a semiconductor device may be mechanically damaged by mechanical strain. According to an exemplary embodiment of the present invention, this mechanical strain may be transferred through the layer structure to the substrate by a grid of grounding structures and isolation and passivation layers which are connected by the grounding structures. This may provide for an enhancement of the lifetime of the semiconductor devices.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: November 22, 2011
    Assignee: NXP B.V.
    Inventors: Soenke Habenicht, Ansgar Thorns, Heinrich Zeile
  • Publication number: 20080251907
    Abstract: The present invention relates to an electronic device whose component body contains at least one stress relief element (4), a substrate (1) with an upper surface and side walls at least one circuit element (2) located on said substrate (1) and at least one passivation and/or isolating layer (3) placed on said substrate (1), whereby said isolating layer (3) covers said at least one circuit element (2) and/or said substrate (1) and contains a top surface, at least one outer side surface which is located towards a side wall of said substrate and at least one outer edge, which is formed by said top surface and said at least one outer side surface, characterized in that at least one stress relief element (4) is made out of a ductile material and simultaneously a) covers the top surface of said passivation and/or isolating layer (3); and b) overlaps said outer edge of said passivation and/or isolating layer (3); and c) extends along said outer surface of said passivation and/or isolating layer (3); and d1) con
    Type: Application
    Filed: March 3, 2005
    Publication date: October 16, 2008
    Applicant: Koninklijke Philips Electronics N.V.
    Inventors: Soenke Habenicht, Ansgar Thorns, Heinrich Zeile
  • Publication number: 20080217785
    Abstract: Conductions and vias between different, stacked metallic layers of a semiconductor device may be mechanically damaged by mechanical strain. According to an exemplary embodiment of the present invention, this mechanical strain may be transferred through the layer structure to the substrate by a grid of grounding structures and isolation and passivation layers which are connected by the grounding structures. This may provide for an enhancement of the lifetime of the semiconductor devices.
    Type: Application
    Filed: July 31, 2006
    Publication date: September 11, 2008
    Applicant: NXP B.V.
    Inventors: Soenke Habenicht, Ansgar Thorns, Heinrich Zeile