Patents by Inventor Ansheng Wu

Ansheng Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230041430
    Abstract: Disclosed is a MEMS chip that in certain embodiments includes a substrate with a back cavity, and a plate capacitor bank provided on the substrate; the plate capacitor bank at least includes a first plate capacitor structure and a second plate capacitor structure located below the first plate capacitor structure and arranged in parallel with the first plate capacitor structure; the first plate capacitor structure includes a first diaphragm and a first hack electrode; and the second plate capacitor structure includes a second. diaphragm and a second back electrode.
    Type: Application
    Filed: April 1, 2020
    Publication date: February 9, 2023
    Applicant: Weifang Goertek Microelectronics Co., Ltd.
    Inventors: GUANXUN QIU, Ansheng Wu, Bo Liu
  • Publication number: 20220388836
    Abstract: Disclosed are a MEMS chip and an electronic device. The chip can include a substrate having a back cavity, as well as a back electrode and an induction membrane both disposed on the substrate, wherein the back electrode and the induction membrane are located on the back cavity and constitute a capacitor structure, the induction membrane comprises an active area opposite to the back cavity, an inactive area disposed outside the active area, and an isolation area located between the active area and the inactive area, and the isolation area comprises two insulation loops connected to the active area and the inactive area respectively, and a buffer area connected between the two insulation loops, both of the insulation loops being disposed around the active area.
    Type: Application
    Filed: October 9, 2019
    Publication date: December 8, 2022
    Applicant: Weifang Goertek Microelectronics Co., Ltd.
    Inventors: BO Liu, Ansheng Wu