Abstract: A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (?B) for separating the substrate along the separation line is smaller than a first reference stress (?R1) of the substrate and such that an edge strength ?K of the separation edge obtained after separation is greater than a second reference stress (?R2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

Abstract: A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (?B) for separating the substrate along the separation line is smaller than a first reference stress (?R1) of the substrate and such that an edge strength ?K of the separation edge obtained after separation is greater than a second reference stress (?R2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

Abstract: A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (?B) for separating the substrate along the separation line is smaller than a first reference stress (?R1) of the substrate and such that an edge strength ?K of the separation edge obtained after separation is greater than a second reference stress (?R2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

Abstract: A soldering head for an induction-soldering apparatus for soldering a contact strip onto a solar cell and a soldering process using the soldering head are provided. The soldering head has a soldering side, with which the soldering head is placed onto the site to be soldered during the soldering process, an inductor loop with a feed region and a coupling-out region arranged on the soldering side, a main body made of an electrically non-conductive material, and a fastener, with which the main body is fixed to the inductor loop, wherein the coupling-out region of the inductor loop is exposed on the soldering side, and the main body has one or more spacer elements, on the soldering side, which are arranged outside the coupling-out region and protrude beyond the coupling-out region of the inductor loop.