Patents by Inventor Anthonius J. H. Snoeyen

Anthonius J. H. Snoeyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6210148
    Abstract: An injection-molding apparatus comprises a mold (3) having a first and a second mold section (5, 7). A bounding surface (13) of the second mold section (7) is in contact with a base (19) of the injection-molding apparatus. A movable punch (81) for severing a sprue slug from the product and an ejector for ejecting the sprue slug from the punch have been provided in the second mold section. The injection-molding apparatus further comprises an arrangement (93, 99) for moving the punch and the ejector. This arrangement is externally of the mold inside the base. As a result of this, the mold can be of compact construction and no connection lines for moving the punch and the ejector are required, so that the mold can be removed rapidly from the injection-molding apparatus. The punch (81) and the ejector (91) have been divided at the location of the bounding surface (113).
    Type: Grant
    Filed: May 25, 1993
    Date of Patent: April 3, 2001
    Assignee: U.S. Philips Corporation
    Inventor: Anthonius J. H. Snoeyen
  • Patent number: 5551625
    Abstract: A mold (1) has two molding members (4, 6) each comprising two plates (11, 13; 15, 17) secured to one another. In the contact surface of one of the plates (13, 15) a groove (19) has been provided to form a cooling duct. In order to reduce the dimensions of such a molding member (4, 6) the two plates (11, 13; 15, 17) are secured to one another by means of a soldering process. In comparison with the known method of securing the plates of a molding member to one another by means of bolts this method has the advantage that no screwthread has to be provided in the plates and no additional sealing, for example by means of an O-ring, has to be provided between the plates in order to seal the cooling duct. As a result of this, the plates can be thinner so that the molding members (4, 6) and the mold (1) can be smaller.
    Type: Grant
    Filed: July 7, 1995
    Date of Patent: September 3, 1996
    Assignee: U.S. Philips Corporation
    Inventor: Anthonius J. H. Snoeyen