Patents by Inventor Anthony Chung

Anthony Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a low resistivity Ti-containing interconnect and semiconductor device comprising the same
    Patent number: 6906421
    Abstract: This invention relates to a method of forming a local interconnect and a semiconductor device comprising a local interconnect. The semiconductor device comprises: a) a dielectric outside layer; and b) a conductivity structure comprising: i) at least one barrier layer having a thickness of 10-200 ? on a surface of said oxide layer; and ii) a conductive layer comprising titanium, on said at least one barrier layer, said at least one barrier layer preventing diffusion of oxygen from said dielectric oxide layer into said conductive layer and having a corresponding oxide that is not soluble in said conductive layer.
    Type: Grant
    Filed: January 14, 1998
    Date of Patent: June 14, 2005
    Assignee: Cypress Semiconductor Corporation
    Inventors: Ende Shan, Gorley Lau, Anthony Chung