Abstract: A system for analyzing the concentration of a first component in a sample fluid is described. The system provides a mixture of sample fluid and control fluid to a fluid concentration measuring apparatus in a controlled ratio. The system stores flow change model, representing the variation in time of the flow of the sample fluid through the system between a valving and the fluid concentration measuring apparatus in response to a variation of the controlled rate by the valving. The system estimates the concentration of the first component in the sample fluid based at least in part on the controlled ratio, and the flow change model.

Abstract: Embodiments of the invention provide a method of processing marine seismic data, the data having been acquired using a “dense over/sparse under” streamer array having N over streamers disposed at a first depth and M under streamers disposed at a second depth greater than the first depth, where 0<M<N. The method comprises: a) processing seismic data for one of the over streamer target locations and seismic data for one of the under streamer target locations; b) processing seismic data for another of the over streamer target locations; and c) combining the result of (a) and the result of (b). The one of the over streamer target locations and the one of the under streamer target locations may lie in a vertical plane.

Abstract: An interconnect structure comprises a solder including nickel (Ni) in a range of 0.01 to 0.20 percent by weight. The interconnect structure further includes an intermetallic compound (IMC) layer in contact with the solder. The IMC layer comprises a compound of copper and nickel.

Abstract: A method to calibrate a flow meter includes passing a predetermined volume of fluid through a flow meter for calibration and determining a time duration of calibration from a start time to a stop time. One or more characteristics of the flow rate of the fluid is measured with the flow meter during the time duration and a plurality of time stamped measurements based on the one or more measured flow rate characteristics are generated. The flow meter is then calibrated based on the start time, the stop time, and the plurality of time stamped measurements.

Abstract: An interconnect structure comprises a solder including nickel (Ni) in a range of 0.01 to 0.20 percent by weight. The interconnect structure further includes an intermetallic compound (IMC) layer in contact with the solder. The IMC layer comprises a compound of copper and nickel.

Abstract: Embodiments of the invention provide a method of processing marine seismic data, the data having been acquired using a “dense over/sparse under” streamer array having N over streamers disposed at a first depth and M under streamers disposed at a second depth greater than the first depth, where 0<M<N. The method comprises: a) processing seismic data for one of the over streamer target locations and seismic data for one of the under streamer target locations; b) processing seismic data for another of the over streamer target locations; and c) combining the result of (a) and the result of (b). The one of the over streamer target locations and the one of the under streamer target locations may lie in a vertical plane.

Abstract: An interconnect structure comprises a solder including nickel (Ni) and tin (Sn), with the nickel in a range of 0.01 to 0.20 percent by weight. The interconnect structure further includes an intermetallic compound (IMC) layer in contact with the solder. The (IMC) layer comprises a compound of copper and nickel.

Abstract: In wafer-level chip-scale packaging and flip-chip packaging and assemblies, a solder cap is formed on a vertical pillar. In one embodiment, the vertical pillar overlies a semiconductor substrate. A solder paste, which may be doped with at least one trace element, is applied on a top surface of the pillar structure. A reflow process is performed after applying the solder paste to provide the solder cap.

Abstract: A semiconductor device package, for example a flip-chip package, having a solder bump mounted above a polymer layer for use in flip-chip mounting of a semiconductor device to a circuit board. A polymer layer such as polybenzoxazole is formed overlying a wafer passivation layer. Solder bumps are attached to an under-bump metallization layer and electrically coupled to conductive bond pads exposed by openings in the wafer passivation layer.

Abstract: The structure described herein incorporates an interconnect positioned between two spaced electrical contacts. The interconnect comprises a lead (Pb)-free solder alloy consisting essentially of nickel (Ni), tin (Sn), silver (Ag), and copper (Cu). The nickel (Ni) content is sufficient to produce a smooth interfacial IMC layer in an under bump metallurgy (UBM) when disposed between the two contacts. An embodiment of the structure described herein is a device comprising a substrate, an under bump metallurgy (UBM) disposed on the substrate, a bulk solder body disposed on the under bump metallurgy (UBM), and a wafer device connected to the under bump metallurgy (UBM) through the bulk solder body. The bulk solder body comprises of nickel (Ni), tin (Sn), silver (Ag), and copper (Cu). The nickel (Ni) is in a range of 0.01 to 0.20 percent by weight (wt %).

Abstract: An inflator for an airbag has a cylindrical housing forming a pressure vessel for storing inert gas within a first end portion; a second end portion forming a separate combustion chamber, and an intermediate diffusion portion interposed between the first and second end portions for exhausting gases from the inflator into an airbag. The inflator has a first gas generator subassembly disposed within the first end portion and in communication with the stored inert gas. A second gas generator subassembly has a combustion chamber which is disposed within the second end portion and isolated from the inert gas by one or more rupturable sealing disks. The actuation of the inflator can be accomplished such that one or both of the gas generators can be ignited. The ignition can be simultaneously or sequential permitting either very rapid full filling of the airbag or slower prolonged filling.

Abstract: An airbag module assembly (400) has a module housing (402). An airbag (401) and an airbag inflator (200, 300) are positioned inside the module housing. The airbag inflator (200, 300) has an exhaust port end (85) extending external of the module housing (402) for venting inflation gasses directly from the airbag inflator (200, 300) externally of the module housing (402).

Abstract: An airbag inflator (200, 300) for inflating an airbag has a tubular inflator housing (11) having a first end (A) and a second end (B). A gas release mechanism (80) has an exhaust port end or housing (85) at the first end (A) for releasing gas directly from the tubular inflator housing (11) to ambient air, bypassing the airbag. A heater assembly (2) containing a gas generant is located and attached at the second end (B). An igniter (3) ignites the heater assembly (2). A primary gas vent port (70) vents gas from the tubular inflator housing (11) into an airbag during normal deployment of the airbag. The gas release mechanism (80) has a passageway or opening (84) for exhausting gas from the tubular inflator housing (11) to an exhaust port (85). A seal (82, 83) seals the passageway or opening (84) of the gas release mechanism (80). An igniter 3 for opens the seal (82, 83) thereby terminating or slowing deployment and normal inflation of the airbag through the primary vent port (70).

Abstract: The present invention described hereafter provides a single stage inflator with a disk shaped inflator housing with one initiator having a single initiating squib located in an initiator housing, the initiator housing being offset relative to the centerline of the disk shaped inflator housing.

Abstract: A dual stage invention is designed to autoignite an autoignition material before a low temperature gas generant melts. Low temperature gas generants include a high nitrogen content organic fuel with ammonium nitrate as the oxidizer. The dual stage inflator has a first gas generant and a second gas generant that are ignited by separate igniters. The first gas generant and the second gas generant are insulated from the inflator housing to delay the heat transfer from the housing to the first gas generant and second gas generant during a bonfire test, which needs to be passed to receive Department of Transportation classification. The dual stage inflator also has an autoignition cartridge for disposing of the second gas generant by the first gas generant after the first gas generant burns for a predetermined amount of time.