Patents by Inventor Anthony D. Studer

Anthony D. Studer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6981764
    Abstract: A heat stake head assembly includes a heating module including a heatable head surface, and a module head which includes a housing having a plurality of through receptacles formed between a first surface and a second surface. The module head is mountable onto the heating module such that the first surface is in contact with the heatable head surface. A set of stake tip elements are provided, each having a head end and a tip, each for fitting into one of the plurality of through receptacles such that the tips of the stake tip elements protrude from the second surface. A plurality of biasing structures bias a respective stake tip element into contact with the heatable head surface.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: January 3, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Anthony D. Studer, Kevin D. Almen
  • Patent number: 6981763
    Abstract: A fluid containment structure includes a containment vessel having an interior vessel space for fluid containment, and a fluid outlet communicating with the interior vessel space. A flexible bag with opposed side surfaces is disposed within the containment vessel, vented to an external atmosphere outside the containment vessel. A sacrificial bond structure is formed between the side surfaces, and restrains the side surfaces together until a back-pressure within the vessel space exerts sufficient force to break the sacrificial bond structure, allowing air from the external atmosphere to enter the bag and enlarge an interior bag space.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: January 3, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Anthony D. Studer, Kevin D. Almen, David M. Hagen, David J. Benson, Cary R. Bybee
  • Patent number: 6969163
    Abstract: Ink reservoirs and methods are provided. One ink reservoir has at least one compartment and first and second vents that communicatively couple the compartment to an atmosphere surrounding an exterior of the ink reservoir.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: November 29, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Anthony D. Studer, Kevin D. Almen, David J. Benson, Cary R. Bybee, David M. Hagen
  • Patent number: 6905198
    Abstract: A high efficiency, liquid supply vessel is provided. The liquid supply vessel includes a chamber, either an open-foam or septum-based fluidic interconnect, a tower, and at least one gas-permeable vent. The tower includes a valve which remains closed when the vessel is inserted into a printer and the fluidic interconnect is engaged, thereby retaining the liquid in the vessel. When the printhead is operated, a sufficient vacuum is created to open the valve, thereby supplying the liquid to the printhead. Whereas the vacuum pressure may otherwise rise to unacceptable levels, the gas-permeable vent enables the pressure to be equalized. Similarly, the vent equalizes pressure during altitude and/or temperature changes, thereby preventing pressure increases or decreases which would otherwise be associated with such changes.
    Type: Grant
    Filed: July 24, 2003
    Date of Patent: June 14, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Anthony D. Studer, Kevin D. Almen, Cary R. Bybee
  • Patent number: 6776479
    Abstract: Venting mechanisms are provided for allowing air to replace fluid in the sealed fluid interconnect port of a container substantially filled with a capillary material, thus enabling absorption of residual fluid into the container capillary material. In one embodiment, the venting mechanisms include small ribs formed on the floor of the container body to space the capillary material away from the floor, thus allowing air to flow along the container floor to the interconnect port.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: August 17, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael S. Ardito, Anthony D. Studer, Curt G. Gonzales
  • Patent number: 6739708
    Abstract: Disclosed are mechanisms and methods for venting the fluid interconnect port of fluid container that is at least partially filled with a capillary material. Preferred embodiments include venting a fluid container to ambient air with a vent located on the upper portion of the container; internally venting the container to channel air from the ambient air vent to an internal location adjacent to the fluid interconnect port; and then restrictedly venting the fluid port. Preferred embodiments also include positioning the restricted venting away from the bulk of the capillary material in the fluid container, and providing a capillary break and capillary accumulator adjacent to the fluid interconnect port.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: May 25, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Anthony D. Studer, Kevin D. Almen, David J. Benson
  • Publication number: 20040085413
    Abstract: Venting mechanisms are provided for allowing air to replace fluid in the sealed fluid interconnect port of a container substantially filled with a capillary material, thus enabling absorption of residual fluid into the container capillary material. In one embodiment, the venting mechanisms include small ribs formed on the floor of the container body to space the capillary material away from the floor, thus allowing air to flow along the container floor to the interconnect port.
    Type: Application
    Filed: October 31, 2002
    Publication date: May 6, 2004
    Inventors: Michael S. Ardito, Anthony D. Studer, Curt G. Gonzales
  • Publication number: 20030202063
    Abstract: Disclosed are mechanisms and methods for venting the fluid interconnect port of fluid container that is at least partially filled with a capillary material. Preferred embodiments include venting a fluid container to ambient air with a vent located on the upper portion of the container; internally venting the container to channel air from the ambient air vent to an internal location adjacent to the fluid interconnect port; and then restrictedly venting the fluid port. Preferred embodiments also include positioning the restricted venting away from the bulk of the capillary material in the fluid container, and providing a capillary break and capillary accumulator adjacent to the fluid interconnect port.
    Type: Application
    Filed: April 30, 2002
    Publication date: October 30, 2003
    Inventors: Anthony D. Studer, Kevin D. Almen, David J. Benson