Patents by Inventor Anthony Dajac

Anthony Dajac has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor dice with edge cavities
    Publication number: 20050056871
    Abstract: A rounded wafer blade and stacked semiconductor package having a die with a cavity defined by a curved lower surface thereof. The curved lower surface and cavity allow for wire bonding directly therebelow at the top surface of another die of the semiconductor package. Additionally, wire bonding may proceed at a surface of the die opposite the curved lower surface without significant impact on a structural integrity of the die.
    Type: Application
    Filed: October 27, 2004
    Publication date: March 17, 2005
    Inventors: Reginald Taar, Anthony Dajac, Carlo Tiongson