Patents by Inventor Anthony E. Stephens

Anthony E. Stephens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for polishing semiconductor wafer edges
    Patent number: 5274959
    Abstract: A system and method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.
    Type: Grant
    Filed: December 11, 1992
    Date of Patent: January 4, 1994
    Assignee: Texas Instruments Incorporated
    Inventors: Lawrence D. Dyer, Anthony E. Stephens, Frank Allen, Keith M. Easton, James A. Kennon, Jerry B. Medders, Frederick O. Meyer, III
  • Method for polishing semiconductor wafer edges
    Patent number: 5128281
    Abstract: A method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.
    Type: Grant
    Filed: June 5, 1991
    Date of Patent: July 7, 1992
    Assignee: Texas Instruments Incorporated
    Inventors: Lawrence D. Dyer, Anthony E. Stephens, Frank Allen, Keith M. Easton, James A. Kennon, Jerry B. Medders, Frederick O. Meyer, III