Patents by Inventor Anthony F. Beier

Anthony F. Beier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ni-plated target diffusion bonded to a backing plate and method of making same
    Patent number: 6555250
    Abstract: The invention includes a method of forming a heat treated sputtering target assembly. A backing plate is diffusion bonded to a sputtering target to produce a sputtering target assembly. The sputtering target assembly is heat treated to precipitation harden the backing plate of the assembly. The heat treatment includes heating and quenching, with the quenching being performed by immersing the backing plate in a quenchant without submerging the sputtering target.
    Type: Grant
    Filed: May 12, 1999
    Date of Patent: April 29, 2003
    Assignee: Honeywell International Inc.
    Inventors: Ritesh P. Shah, David E. Steele, William R. Turner, Anthony F. Beier, Janine K. Kardokus, Susan D. Strothers
  • Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
    Patent number: 6451185
    Abstract: Described is a method for producing a diffusion bonded sputtering target assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: September 17, 2002
    Assignee: Honeywell International Inc.
    Inventors: Anthony F. Beier, Janine K. Kardokus, Susan D. Strothers
  • NI-PLATED TARGET DIFFUSION BONDED TO A BACKING PLATE AND METHOD OF MAKING SAME
    Publication number: 20020003010
    Abstract: Described is a method of making a heat treated sputtering target and a sputtering target assembly with a prescripitation hardened backing plate diffusion hardened to a sputtering target.
    Type: Application
    Filed: May 12, 1999
    Publication date: January 10, 2002
    Inventors: RITESH P. SHAH, DAVID E. STEELE, WILLIAM R. TURNER, ANTHONY F. BEIER, JANINE K. KARDOKUS, SUSAN D. STROTHERS
  • Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
    Publication number: 20010048019
    Abstract: Described is a method for producing a diffusion bonded sputtering target assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.
    Type: Application
    Filed: July 9, 2001
    Publication date: December 6, 2001
    Inventors: Anthony F. Beier, Janine K. Kardokus, Susan D. Strothers
  • Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
    Patent number: 6274015
    Abstract: Described is a method for producing a diffusion bonded sputtering assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.
    Type: Grant
    Filed: August 12, 1998
    Date of Patent: August 14, 2001
    Assignee: Honeywell International, Inc.
    Inventors: Anthony F. Beier, Janine K. Kardokus, Susan D. Strothers