Abstract: An enhanced low noise relief valve renders the anodizing processing irrelevant to the low leakage nature of the valve member based on the tolerance between the tube portion of the valve member and the inlet bore of the machined housing. This is accomplished by providing an additional valve stem holder that acts as a stem holder through which at least part of the tube portion of the valve member extends, with the stem holder instead of the valve member tube being located adjacent to the bore of the machined housing. The stem holder does not need to be subject to the anodizing process, and therefore a tight tolerance between the valve member and stem holder provides adequate leakage control, and the anodizing process applied to the machined housing otherwise is separated from the location where leakage tolerance is critical.

Abstract: One embodiment of a processing system for fabricating compound nitride semiconductor devices comprises one or more processing chamber operable with form a compound nitride semiconductor layer on a substrate, a transfer chamber coupled with the processing chamber, a loadlock chamber coupled with the transfer chamber, and a load station coupled with the loadlock chamber, wherein the load station comprises a conveyor tray movable to convey a carrier plate loaded with one or more substrates into the loadlock chamber. Compared to a single chamber reactor, the multi-chamber processing system expands the potential complexity and variety of compound structures. Additionally, the system can achieve higher quality and yield by specialization of individual chambers for specific epitaxial growth processes. Throughput is increased by simultaneous processing in multiple chambers.

Abstract: A system and a method for reducing the rate at which volatile contaminants are deposited onto one or more optical components of a substrate processing system are disclosed. A purge fluid is introduced into the processing system at an interior surface of the processing system. A flow of purge fluid is produced across the interior surface to form a contaminant-entraining barrier between a source of the volatile contaminants and the one or more optical components and thereby reduce the rate at which volatile contaminants are deposited onto the optical components of the system. The purge fluid is substantially removed from the processing system.

Abstract: A non-contacting, non-clogging, electro-mechanically operated marking device or inker for continuous or intermittently marking a semiconductor wafer die is disclosed together with a method of operating the device. The marking device has an ambient pressure ink reservoir within which is mounted a thin, capillary filament guide tube. A length of filament such as, fishline, is positioned within the tube and secured at one end to the plunger of a solenoid. The distal end of the filament is driven out of the capillary tube by the solenoid to force a small amount of the marking fluid or ink out of the reservoir and onto the die without the filament contacting the die. The solenoid coil is energized by a current pulse having a first current level and a second current level that is less than the first current level. The second current level provides a short holding current for the solenoid to prevent spattering of the marking fluid.