Abstract: The apparatus of the present invention addresses the unique problem of punching centrally located holes in stoma-wafers, and comprises a base portion fixed to a surface such as a table or the like, the base portion having a raised annular projection for placement of a stoma-wafer thereupon with the projection fittingly engaging into the hole of the stoma-wafer. The base portion further includes an upper arm member fixed to the base portion and extending to a point directly above the location of the raised projection. The fixed member has a vertically movable plunger element with an annular blade threadably attached to the lower end of it, the annular blade being of a size larger than the raised projection, so that movement of the blade downward would cut a hole in the wafer to the appropriate size of the blade as the stoma-wafer is centrally located on the projection.