Patents by Inventor Anthony G. Van Woerkom

Anthony G. Van Woerkom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer polishing method and apparatus
    Patent number: 5498196
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: May 18, 1994
    Date of Patent: March 12, 1996
    Assignee: Speedfam Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi
  • Wafer polishing method and apparatus
    Patent number: 5498199
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: July 15, 1994
    Date of Patent: March 12, 1996
    Assignee: Speedfam Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi, Spencer Preston
  • Device for conditioning polishing pads
    Patent number: 5486131
    Abstract: A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.
    Type: Grant
    Filed: January 4, 1994
    Date of Patent: January 23, 1996
    Assignee: Speedfam Corporation
    Inventors: Joseph V. Cesna, Anthony G. Van Woerkom
  • Wafer polishing method and apparatus
    Patent number: 5329732
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: June 15, 1992
    Date of Patent: July 19, 1994
    Assignee: Speedfam Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi
  • Wafer polishing method and apparatus
    Patent number: RE37622
    Abstract: A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of wafer carriers are substantially simultaneously unloaded into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: April 2, 2002
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Chris E. Karlsrud, Anthony G. Van Woerkom, Shigeru Odagiri, Isao Nagahashi