Abstract: A molding composition that is particularly useful for coating and encapsulating electronic or electrical devices is disclosed. The molding composition exhibits improved flame retardancy and includes an epoxy resin, a hardener for the epoxy resin, and flame retardant compounds of melamine cyanurate and an oxyanion of a Group VIA element, such as tungsten trioxide.

Abstract: A gas augmented drive system and method for a hybrid electric vehicle. The system and method utilizes compressed gas to turn a turbine, the rotation of which generates power that can be used, among other things, to power the vehicle batteries and/or power a secondary electrical system.

Abstract: Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed is the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits. The flame retardant molding compositions include an epoxy resin; a first transition metal oxide containing a refractory metal, such as tungsten trioxide; and a second transition metal oxide containing an oxyanion of a Group VIA element and a cation of a Group IIA element, such as calcium molybdate.

Abstract: Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed is the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits. The flame retardant molding compositions include an epoxy resin; a first transition metal oxide containing a refractory metal, such as tungsten trioxide; and a second transition metal oxide containing an oxyanion of a Group VIA element and a cation of a Group IIA element, such as calcium molybdate.

Abstract: Flame retardant molding compositions that are substantially free of halogen, phosphorus, and antimony are disclosed. Also disclosed are the use of these flame retardant molding compositions to coat electronic devices such as integrated circuits.

Abstract: The invention relates to a method of preparing a polybenzoxazine which includes heating a molding composition including a benzoxazine and a heterocyclic dicarboxylic acid to a temperature sufficient to cure the molding composition, thereby forming the polybenzoxazine. Also disclosed are a method of preparing a polybenzoxazine composition having near-zero volume change after post cure and a method of coating a device using a polybenzoxazine composition of this invention.

Abstract: A pry bar with a built in hammer includes a slide bar including an elongated linear section, a first pry section at a first end of the elongated linear section and angled relative thereto, the first pry section including a front edge with a first notch therein, a side edge which meets the front edge at a corner, a second notch at the side edge immediately adjacent the corner, and a nail entrapment notch in the side edge, and a second pry section at a second end of the elongated linear section and angled relative thereto, the second pry section including a front edge with a notch therein; a first stop fixed to the elongated linear section adjacent the first pry section; a second stop fixed adjacent to the elongated linear section adjacent the second pry section; and a slide hammer slidably mounted on the elongated linear section between the first and second stops in order to impact against the first stop.

Abstract: This invention relates to a composition containing a hydrophobic solvent, a network polymer and a flow control agent which is useful in healing wounds. The composition of this invention may be applied directly to a wound to create a structured occlusive dressing. The dressings of this invention do not migrate, but maintain their integrity at skin temperature, and encourage the creation of a moist wound environment while protecting the wound in order to accelerate healing.

Abstract: An acoustic damping material that includes at least one resilient sheet, wherein each of the sheets have a first side and a second side, and wherein at least two portions of the sides face each other to form a multi-layered structure, is provided. The resilient sheet may be made from any resilient polymer film, such as a polyolefin, and especially polyethylene. Also provided is an acoustic speaker system that has an exceptionally flat frequency response, especially at low audible frequencies. The system includes an enclosure, a speaker mounted to the enclosure, and acoustic damping material (according to this invention) inside the enclosure. An acoustic damping panel, which includes a frame and acoustic damping material fixed to the frame, is also provided.

Abstract: An acoustic speaker system according to this invention is provided that includes a conventional woofer, an electro-acoustic converter that functions as a tweeter, and a system enclosure. The converter includes an electro-acoustic transducer and a variable density hollow body. The transducer includes a piezoelectric sheet and two conductive electrodes. One electrode is disposed on each face of the sheet. Coatings are optionally disposed on each side of the transducer. The transducer is wrapped around a variable density body which may be filled with an acoustic dampening material. The acoustic speaker system enclosure includes a hollow ellipsoidal woofer enclosure with a portion of its outer surface for mounting an electro-acoustic converter, and optionally, a converter cover. The acoustic speaker system also includes an elastomeric cover that is fastened to the dome portion of a woofer.

Abstract: This invention relates to a composition containing a hydrophobic solvent, a network polymer and a flow control agent which is useful in healing wounds. The composition of this invention may be applied directly to a wound to create a structured occlusive dressing. The dressings of this invention do not migrate, but maintain their integrity at skin temperature, and encourage the creation of a moist wound environment while protecting the wound in order to accelerate healing.

Abstract: A system for the continuous production of asphalt-based roofing shakes which are tapered and embossed to resemble wood shakes in looks and function; and the shake made thereby. The continuous production system hot-mixes and extrudes the ingredients in a tapered layer on a conveyor belt for embossing and cutting. The system permits wood-shake type variety in size and appearance. The preferred shake includes perlite as a filler and chopped glass fibers as a reinforcer and may be internally colored.

Abstract: A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a halogen (which can be part of the resin or the hardener), and an oxidizing refractory metal oxide, preferably on oxidizing metal oxide of an element selected from the Group VIA of the Periodic Table. The flame retardant epoxy molding compounds when used to encapsulated semiconductor devices have synergistic flame retardant properties.

Abstract: A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the meta-brominated cresol epoxy novolac type, preferably containing at least about 0.5% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of from less than about 0.8% by weight of the molding compound, and an amount of magnesium aluminum carbonate hydrate less than or about 4.0% by weight of the molding compound. The flame retardant epoxy compounds when used to encapsulated the semiconductor devices have improved high temperature stability and reliability compared to similar prior art molding compounds.

Abstract: A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the meta-brominated cresol epoxy novolac type, preferably containing at least about 0.5% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of from less than about 0.8% by weight of the molding compound, and an amount of magnesium aluminum carbonate hydrate less than or about 4.0% by weight of the molding compound. The flame retardant epoxy compounds when used to encapsulated the semiconductor devices have improved high temperature stability and reliability compared to similar prior art molding compounds.

Abstract: An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of .ltoreq. about 0.8% by weight of the molding compound, and an amount of bismuth trioxide .ltoreq. about 4.0% by weight of the molding compound.

Abstract: An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of .ltoreq. about 0.8% by weight of the molding compound, and an amount of bismuth trioxide .ltoreq. about 4.0% by weight of the molding compound.

Abstract: A method of preparing an organosilazane including reacting a first halosilane having the formula RR.sup.1 SiX.sub.2, wherein X is F, Cl, Br, or I, and each R and R.sup.1, independently, is X, H, or a lower alkyl group; a first primary amine compound having the formula R.sup.2 NH.sub.2, wherein R.sup.2 is H or a lower alkyl group; and a second primary amine compound having the formula R.sup.3 NH.sub.2, wherein R.sup.3 is H or a lower alkyl group, R.sup.3 being different from R.sup.2, to form the organosilazane.

Abstract: A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the meta-brominated cresol epoxy novolac type, preferably containing at least about 0.5% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony peroxide, a lower percent of antimony pentoxide, preferably in the range of from less than about 0.8% by weight of the molding compound, and an amount of magnesium aluminum carbonate hydrate less than or about 4.0% by weight of the molding compound. The flame retardant epoxy compounds when used to encapsulate the semiconductor devices have improved high temperature stability and reliability compared to similar prior art molding compounds.

Abstract: An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.01-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of from about 0.4 to about 0.8% by weight of the molding compound, and an amount of bismuth trioxide from about 1.6 to about 4.0% by weight of the molding compound.