Abstract: A method and apparatus for transporting a liquid gas container is described herein. The liquid gas container is transported at an increased internal pressure. Transporting the liquid gas container at an increased internal pressure distributes the downward load of the liquid gas container, such that the downward load of the liquid gas container is distributed more evenly or so that a greater amount of the downward load is felt in the center of the liquid gas container compared to the outer portion of the liquid gas container. This enables transport without cracking of a base support slab during transit when the support slab is only able to be supported from the center due to narrow road conditions.

Abstract: Systems and techniques that facilitate scalable cryostats and cryogenic systems are provides. In an embodiment, a cryogenic system can comprise a plurality of unit cells joined together, wherein each unit cell comprises: a frame; and at least one temperature shell; wherein frames from adjacent unit cells are connected in a vacuum-tight manner to form a continuous, global vacuum enclosure, and temperature shells from adjacent unit cells are connected to form a continuous, global temperature shell.

Abstract: Systems and techniques that facilitate coupling a superconducting cable to a interconnect chip and a quantum processor. In various embodiments, a system can comprise a quantum processor, one or more interconnect chips, and one or more cable connections. The quantum processor can comprise a plurality of qubits. Additionally, the one or more interconnect chips can be bonded to the quantum processor, and the one or more cable connections can be coupled to the one or more interconnect chips. With embodiments, the one or more interconnect chips can comprise one or more signal routings from the one or more cable connections to the quantum processor. Further, in embodiments, a first signal can pass from the one or more cable connections to at least one of the plurality of qubits.

Abstract: One or more devices and/or methods provided herein relate to a method for fabricating a filtering electronic device having a co-integrated impedance modification element and signal transmission line. An electronic structure can comprise a circuit board, and a first plate and a second plate retaining the circuit board therebetween, wherein the first plate and the second plate each have a cryogenic thermal contraction rate that is lower than a cryogenic thermal contraction rate of the circuit board. In one or more embodiments, a silicon chip can be physically coupled to the circuit board by a plurality of solder bumps and disposed between the first plate and the second plate.

Abstract: Various embodiments of a system and method for capturing changes in trade information that impact trade authorization and for updating a chain state on a distributed chain database that is used to authorize trades are disclosed herein. In some embodiments, the system comprises: a trade controller configured to obtain a current state from a local database; a rules engine configured to be invoked by the trade controller to apply a ruleset to data extracted from the local database to generate an updated state; an operation auto detector configured to generate a plan to update a chain state on the distributed chain database based at least in part on the updated state; and an execution engine configured to execute the plan and to generate an updated chain state that is used to authorize trades.

Abstract: A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.

Abstract: Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

Abstract: Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

Abstract: A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.

Abstract: A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.

Abstract: Described is an energy curable ink for use in the production of layered composites the ink comprising 3 to 50% by weight of aminoacrylate as defined herein, 5 to 60% by weight of hydroxyl functional acrylate monomer and wherein the non-volatile content of the ink is not less than 45% by weight. Also described is a layered composite having a layer of the energy curable ink on a substrate and a process for producing a layered composite in which the energy curable ink according to the present invention is printed onto a substrate and then cured.

Abstract: The application relates to a method, an electronic device and a program for recommending a foundation product from.

Abstract: The present invention provides a method for printing energy-curable ink and coating compositions that have good adhesion to substrates, good print quality, solvent and scratch resistance, and low potential for migration of uncured monomers. The method comprises the steps of printing the ink or coating onto a substrate; partially curing the printed ink or coating by irradiating with UV energy; optionally printing and partially UV curing additional ink layers printed on the first layer; and completing curing via exposure to electron beam radiation, wherein the EB cure dose is greater than or equal to 20 kGy, and the accelerating voltage is greater than or equal to 70 keV.

Abstract: A method of operation of a computer system comprising: receiving a tire image for a target tire; determining an analyzability for the target tire based on a wear model including the tire image; analyzing a wear level for the target tire based on the analyzability meets or exceeds a usable threshold; generating an augmented reality image for the wear level for the target tire; and communicating the augmented reality image for displaying the wear level for the target tire.

Abstract: Techniques are described for managing cookies, including separately managing cookie data associated with different browser tabs. Cookie management includes the isolation of whitelisted cookies from server responses into background storage and then back onto server requests, removing those cookies from the response header and thus from the cookie store. This isolation is managed with the concept of tab ownership between parent and child tabs to maintain isolation separately for each owner (e.g., the parent) and its children. Exposure to client pages is handled by placing those cookies into a keyed location in session storage for every tab where that cookie is to be visible. An event is then triggered for that client page to let it know that session storage has been updated.

Abstract: Electron beam curable compositions including polyols, and any blend of ethylenically unsaturated monomers and oligomers. The polyols of the invention are preferably essentially free of any ethylenically unsaturated groups, have greater than one hydroxy group and preferably have boiling points in excess of 170° C.

Abstract: A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.

Abstract: Energy curable compositions including polyols, and any blend of ethylenically unsaturated monomers and oligomers. The polyols of the invention are essentially free of any ethylenically unsaturated groups. It is preferred that the polyol substances according to the invention have greater than one hydroxy group and preferably have boiling points in excess of 170° C. The compositions of the invention are particularly useful for the printing or coating of food packaging and may be applied via any printing or coating method, although inkjet printing is a preferred method.

Abstract: Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

Abstract: A method of operation of a computer system comprising: receiving a tire image for a target tire; determining an analyzability for the target tire based on a wear model including the tire image; analyzing a wear level for the target tire based on the analyzability meets or exceeds a usable threshold; generating an augmented reality image for the wear level for the target tire; and communicating the augmented reality image for displaying the wear level for the target tire.