Patents by Inventor Anthony Hernandez

Anthony Hernandez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260144907
    Abstract: A reader device includes pluralities of first and second contacts and a controller. The first contacts are configured to electrically contact corresponding one or more conductive pads of the sensor device. The first contacts include a first open state in which the first contacts are electrically disconnected and a first closed state in which the first contacts are electrically connected. The second contacts are spaced apart from the first contacts. The second contacts are configured to electrically contact corresponding one or more conductive pads of the sensor device. The second contacts include a second open state in which the second contacts are electrically disconnected and a second closed state in which the second contacts are electrically connected. The controller is configured to determine an error condition if the first contacts are in the first open state and/or the second contacts are in the second open state.
    Type: Application
    Filed: October 9, 2023
    Publication date: May 28, 2026
    Applicant: Solventum Intellectual Properties Company
    Inventors: Benjamin M. Wilke, G. Marco Bommarito, Andrew J. Ma, Anthony J. Jennen, Anthony Hernandez
  • Patent number: 6644984
    Abstract: A plug assembly having a body portion, a plug housing that provides a mounting for AC prongs that creates a cavity therewithin, and a PCB located in the cavity. A pair of contact terminals are mounted on the PCB in a predetermined position so as to create a spring-loaded electrical contact with a corresponding one of the AC prongs during assembly. The present invention reduces the bulkiness, optimizes the packaging size, and reduces the profile of the plug assembly by using the cavity to house the PCB, thereby providing a reduction or elimination of the need to mount components within the body portion. The present invention eliminates the need to use flexible wires, springs, or direct soldering between the AC prongs and the circuitry on the PCB, thereby making assembly quicker and easier through use of the spring loaded contact terminal.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: November 11, 2003
    Assignee: Astec International Limited
    Inventors: Fidel P. Vista, Jr., Jose A. Uy, Jr., Anthony Hernandez, Cesar Ma. C. Calma
  • Publication number: 20030153200
    Abstract: A plug assembly having a body portion, a plug housing that provides a mounting for AC prongs that creates a cavity therewithin, and a PCB located in the cavity. A pair of contact terminals are mounted on the PCB in a predetermined position so as to create a spring-loaded electrical contact with a corresponding one of the AC prongs during assembly. The present invention reduces the bulkiness, optimizes the packaging size, and reduces the profile of the plug assembly by using the cavity to house the PCB, thereby providing a reduction or elimination of the need to mount components within the body portion. The present invention eliminates the need to use flexible wires, springs, or direct soldering between the AC prongs and the circuitry on the PCB, thereby making assembly quicker and easier through use of the spring loaded contact terminal.
    Type: Application
    Filed: February 8, 2002
    Publication date: August 14, 2003
    Inventors: Fidel P. Vista, Jose A. Uy, Anthony Hernandez, Cesar Ma. C. Calma
  • Patent number: 6454604
    Abstract: An enclosure for small power supplies for cellular telephones, laptop computers and the like is formed in two layers. The first layer is an inner box constructed of a pair of about 0.8 mm thick PBT shells that enclose and retain the electronics. The second layer is an overmolding of about 1.0 mm. thick PVC that surrounds the shells, seals them together, and forms a strain relief for a cable attached to the electronics. The two-layer construction allows considerable savings in material and assembly costs.
    Type: Grant
    Filed: September 6, 2000
    Date of Patent: September 24, 2002
    Assignee: Astec International Limited
    Inventors: Gordon Currie, Fidel Vista, Peter Ramos Yeo, Cesar Calma, Anthony Hernandez
  • Patent number: D577719
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: September 30, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Lea Kobeli, Fred Thomas, Andrew Zee, Matthew Peterson, Arthur Sandoval, Kathy Miner, Daniel Thero, Kenneth Wood, Anthony Hernandez