Patents by Inventor Anthony I-Chih Chou
Anthony I-Chih Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190386130Abstract: A semiconductor structure formed based on a buried oxide (BOX) layer configured as a gate dielectric; a substrate adjacent to the BOX layer configured as a first gate electrode; a first source structure and a first drain structure, each residing above the BOX layer; a first channel structure residing between the first drain and first source structures; a second gate electrode residing above the first channel structure; a first shallow trench isolation (STI) structure and a second STI structure, each residing coplanar with and at opposite ends of the first source and first drain structures; and a second gate dielectric residing between the first channel structure and the second gate electrode, wherein a thickness of the second gate dielectric is less than a thickness of the BOX layer.Type: ApplicationFiled: August 30, 2019Publication date: December 19, 2019Inventors: Anthony I-Chih Chou, Arvind Kumar, Sungjae Lee
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Publication number: 20170170265Abstract: A semiconductor structure formed based on a buried oxide (BOX) layer configured as a gate dielectric; a substrate adjacent to the BOX layer configured as a first gate electrode; a first source structure and a first drain structure, each residing above the BOX layer; a first channel structure residing between the first drain and first source structures; a second gate electrode residing above the first channel structure; a first shallow trench isolation (STI) structure and a second STI structure, each residing coplanar with and at opposite ends of the first source and first drain structures; and a second gate dielectric residing between the first channel structure and the second gate electrode, wherein a thickness of the second gate dielectric is less than a thickness of the BOX layer.Type: ApplicationFiled: December 14, 2015Publication date: June 15, 2017Inventors: Anthony I-Chih Chou, Arvind Kumar, Sungjae Lee
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Patent number: 9595518Abstract: Fabrication methods and structure include: providing a wafer with at least one fin extended above a substrate in a first region, and at least one fin extended above the substrate in a second region of the wafer; forming a gate structure extending at least partially over the at least one fin to define a semiconductor device region in the first region; implanting a dopant into the at least one fin in the first region and into the at least one fin in the second region of the wafer, where the implanting of the dopant into the at least one fin of the second region modulates a physical property of the at least one fin to define a resistor device region in the second region; and disposing a conductive material at least partially over the at least one fin in the first region and over the at least one fin in the second region of the wafer, in part, to form a source and drain contact in the first region, and a fin-type metal-semiconductor resistor in the second region.Type: GrantFiled: December 15, 2015Date of Patent: March 14, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Anthony I-Chih Chou, Chengwen Pei, Edward P. Maciejewski, Ning Zhan
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Patent number: 9401325Abstract: A semiconductor structure providing a precision resistive element and method of fabrication is disclosed. Polysilicon is embedded in a silicon substrate. The polysilicon may be doped to control the resistance. Embodiments may include resistors, eFuses, and silicon-on-insulator structures. Some embodiments may include non-rectangular cross sections.Type: GrantFiled: May 23, 2014Date of Patent: July 26, 2016Assignee: International Business Machine CorporationInventors: Anthony I-Chih Chou, Arvind Kumar, Renee T. Mo, Shreesh Narasimha
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Patent number: 9269786Abstract: Standard High-K metal gate (HKMG) CMOS technologies fabricated using the replacement metal gate (RMG), also known as gate-last, integration flow, are susceptible to oxygen ingress into the high-K gate dielectric layer and oxygen diffusion into the gate dielectric and semiconductor channel region. The oxygen at the gate dielectric and semiconductor channel interface induces unwanted oxide regrowth that results in an effective oxide thickness increase, and transistor threshold voltage shifts, both of which are highly variable and degrade semiconductor chip performance. By introducing silicon nitride deposited at low temperature, after the metal gate formation, the oxygen ingress and gate dielectric regrowth can be avoided, and a high semiconductor chip performance is maintained.Type: GrantFiled: September 26, 2013Date of Patent: February 23, 2016Assignee: GLOBALFOUNDRIES Inc.Inventors: Anthony I-Chih Chou, Arvind Kumar, Shreesh Narasimha, Claude Ortolland, Kai Zhao
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Publication number: 20150084132Abstract: Standard High-K metal gate (HKMG) CMOS technologies fabricated using the replacement metal gate (RMG), also known as gate-last, integration flow, are susceptible to oxygen ingress into the high-K gate dielectric layer and oxygen diffusion into the gate dielectric and semiconductor channel region. The oxygen at the gate dielectric and semiconductor channel interface induces unwanted oxide regrowth that results in an effective oxide thickness increase, and transistor threshold voltage shifts, both of which are highly variable and degrade semiconductor chip performance. By introducing silicon nitride deposited at low temperature, after the metal gate formation, the oxygen ingress and gate dielectric regrowth can be avoided, and a high semiconductor chip performance is maintained.Type: ApplicationFiled: September 26, 2013Publication date: March 26, 2015Applicant: International Business Machines CorporationInventors: Anthony I-Chih Chou, Arvind Kumar, Shreesh Narasimha, Claude Ortolland, Kai Zhao
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Publication number: 20140252539Abstract: A semiconductor structure providing a precision resistive element and method of fabrication is disclosed. Polysilicon is embedded in a silicon substrate. The polysilicon may be doped to control the resistance. Embodiments may include resistors, eFuses, and silicon-on-insulator structures. Some embodiments may include non-rectangular cross sections.Type: ApplicationFiled: May 23, 2014Publication date: September 11, 2014Applicant: International Business Machines CorporationInventors: Anthony I-Chih Chou, Arvind Kumar, Renee T. Mo, Shreesh Narasimha
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Patent number: 8829616Abstract: A semiconductor device and method of making same. The device includes a substrate comprising a semiconductor layer on an insulating layer, the semiconductor layer including a semiconductor body having a body contact region and an abutting switching region; a bridged gate over the semiconductor body, the bridged gate having a bridge gate portion and an abutting gate portion, the bridge gate portion comprising a multilayer first gate stack and the gate portion comprising a multilayer second gate stack comprising the gate dielectric layer on the semiconductor body; first and second source/drains formed in the switching region on opposite sides of the channel; and wherein a first work function difference between the bridge portion and the body contact region is different from a second work function difference between the gate portion and the channel region.Type: GrantFiled: October 25, 2012Date of Patent: September 9, 2014Assignee: International Business Machines CorporationInventors: Anthony I-Chih Chou, Murshed M. Chowdhury, Arvind Kumar, Shreesh Narasimha
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Patent number: 8816473Abstract: A semiconductor structure providing a precision resistive element and method of fabrication is disclosed. Polysilicon is embedded in a silicon substrate. The polysilicon may be doped to control the resistance. Embodiments may include resistors, eFuses, and silicon-on-insulator structures. Some embodiments may include non-rectangular cross sections.Type: GrantFiled: April 5, 2012Date of Patent: August 26, 2014Assignee: International Business Machines CorporationInventors: Arvind Kumar, Anthony I-Chih Chou, Renee T. Mo, Shreesh Narasimha
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Publication number: 20140117409Abstract: A semiconductor device and method of making same. The device includes a substrate comprising a semiconductor layer on an insulating layer, the semiconductor layer including a semiconductor body having a body contact region and an abutting switching region; a bridged gate over the semiconductor body, the bridged gate having a bridge gate portion and an abutting gate portion, the bridge gate portion comprising a multilayer first gate stack and the gate portion comprising a multilayer second gate stack comprising the gate dielectric layer on the semiconductor body; first and second source/drains formed in the switching region on opposite sides of the channel; and wherein a first work function difference between the bridge portion and the body contact region is different from a second work function difference between the gate portion and the channel region.Type: ApplicationFiled: October 25, 2012Publication date: May 1, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Anthony I-Chih Chou, Murshed M. Chowdhury, Arvind Kumar, Shreesh Narasimha
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Patent number: 8343781Abstract: An apparatus and method for electrical mask inspection is disclosed. A scan chain is formed amongst two metal layers and a via layer. One of the three layers is a functional layer under test, and the other two layers are test layers. A resistance measurement of the scan chain is used to determine if a potential defect exists within one of the vias or metal segments comprising the scan chain.Type: GrantFiled: September 21, 2010Date of Patent: January 1, 2013Assignee: International Business Machines CorporationInventors: Arvind Kumar, Anthony I-Chih Chou, Shreesh Narasimha
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Publication number: 20120068174Abstract: An apparatus and method for electrical mask inspection is disclosed. A scan chain is formed amongst two metal layers and a via layer. One of the three layers is a functional layer under test, and the other two layers are test layers. A resistance measurement of the scan chain is used to determine if a potential defect exists within one of the vias or metal segments comprising the scan chain.Type: ApplicationFiled: September 21, 2010Publication date: March 22, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Arvind Kumar, Anthony I-Chih Chou, Shreesh Narasimha
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Patent number: 7456115Abstract: The present invention provides methods for forming semiconductor FET devices having reduced gate edge leakage current by using plasma or thermal nitridation and low-temperature plasma re-oxidation processes post gate etch.Type: GrantFiled: July 6, 2005Date of Patent: November 25, 2008Assignee: International Business Machines CorporationInventors: Anthony I-Chih Chou, Shreesh Narasimha
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Patent number: 7160771Abstract: Gate oxides having different thicknesses are formed on a semiconductor substrate by forming a first gate oxide on the top surface of the substrate, forming a sacrificial hard mask over a selected area of the first gate oxide; and then forming a second gate oxide. A first poly layer may be formed on the first gate oxide, under the hard mask. After the hard mask is removed, a second poly layer may be formed over the second gate oxide and over the first poly layer. This enables the use of high-k dielectric materials, and the first gate oxide can be thinner than the second gate oxide.Type: GrantFiled: November 28, 2003Date of Patent: January 9, 2007Assignee: International Business Machines CorporationInventors: Anthony I-Chih Chou, Michael Patrick Chudzik, Toshiharu Furukawa, Oleg Gluschenkov, Paul Daniel Kirsch, Byoung Hun Lee, Katsunori Onishi, Heemyoung Park, Kristen Colleen Scheer, Akihisa Sekiguchi
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Patent number: 6821833Abstract: A method of forming CMOS semiconductor materials with PFET and NFET areas formed on a semiconductor substrate, covered respectively with a PFET and NFET gate dielectric layers composed of silicon oxide and different degrees of nitridation thereof. Provide a silicon substrate with a PFET area and an NFET area and form PFET and NFET gate oxide layers thereover. Provide nitridation of the PFET gate oxide layer above the PFET area to form the PFET gate dielectric layer above the PFET area with a first concentration level of nitrogen atoms in the PFET gate dielectric layer above the PFET area. Provide nitridation of the NFET gate oxide layer to form the NFET gate dielectric layer above the NFET area with a different concentration level of nitrogen atoms from the first concentration level. The NFET gate dielectric layer and the PFET gate dielectric layer can have the same thickness.Type: GrantFiled: September 9, 2003Date of Patent: November 23, 2004Assignee: International Business Machines CorporationInventors: Anthony I-Chih Chou, Toshiharu Furukawa, Patrick R. Varekamp, Jeffrey W. Sleight, Akihisa Sekiguchi