Patents by Inventor Anthony Ingham

Anthony Ingham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER ALLOY
    Publication number: 20160107267
    Abstract: An alloy suitable for use in a wave solder process, hot air levelling process, a ball grid array or chip scale package comprising no more than 3 wt.% bismuth, from 0.15-1.5 wt.% copper, from 0.1-1.5 wt.% silver, and the balance tin, with optionally other alloying elements in certain embodiments, together with unavoidable impurities.
    Type: Application
    Filed: December 22, 2015
    Publication date: April 21, 2016
    Applicant: ALPHA METALS, INC.
    Inventors: Anthony Ingham, Gerard Campbell, Brian G. Lewis, Bawa Singh, John P. Laughlin, Ranjit Pandher
  • THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS
    Publication number: 20070145546
    Abstract: A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
    Type: Application
    Filed: March 6, 2007
    Publication date: June 28, 2007
    Applicant: FRY'S METALS, INC.
    Inventors: Brian Lewis, Bawa Singh, John Laughlin, David Kyaw, Anthony Ingham, Attiganal Sreeram, Leszek Hozer, Michael Liberatore, Gerard Minogue