Patents by Inventor Anthony J. Barresi

Anthony J. Barresi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for applying solder flux to a printed circuit board
    Patent number: 4708281
    Abstract: In a wave soldering apparatus including a station for forming a standing wave of foamed flux, a preheater station, and a standing wave of hot molten solder station, a flux removing apparatus for reducing the thickness of flux on a coated printed circuit board includes an apertured pipe for gently blowing a plurality of streams of air against the foam coated board, the streams acting effectively as a continuous linear stream of air. The airstreams also blow the foamed flux into apertures in the printed circuit board.
    Type: Grant
    Filed: February 16, 1982
    Date of Patent: November 24, 1987
    Assignee: RCA Corporation
    Inventors: Leonard Nelson, Anthony J. Barresi
  • Apparatus and method for vapor phase solder reflow
    Patent number: 4580716
    Abstract: A solder reflow process including vaporized fluorinated organic liquid such as FC-70 is dehumidified by pressurizing the vapor chamber with dry nitrogen and blowing the dry nitrogen against the conveyor belt and article to be soldered as they pass through the inlet throat.
    Type: Grant
    Filed: October 17, 1984
    Date of Patent: April 8, 1986
    Assignee: RCA Corporation
    Inventors: Anthony J. Barresi, John T. Catania, William F. Sweeney, Jr.
  • Chip carrier soldering tool
    Patent number: 4564135
    Abstract: A toll for melting solder on the contacts of a surface mounted electronic component and on the corresponding contacts of a printed circuit substrate to which it is to be soldered or from which it is to be de-soldered. The tool includes a conduit for conducting hot gas to the contacts. A diverter located in the interior of the conduit deflects hot gas away from the top of the surface mounted component and confines the hot gas to the periphery of the component.
    Type: Grant
    Filed: December 29, 1983
    Date of Patent: January 14, 1986
    Assignee: RCA Corporation
    Inventors: Anthony J. Barresi, Leonard Nelson
  • Fixture for solder tinning chip carriers
    Patent number: 4489923
    Abstract: Leadless chip carriers (LCCs) are pretinned using wave soldering equipment. A magnetic fixture having a coating of material which is non-solderable provides a plurality of LCC retention locations. The LCC retention locations are configured to ensure free solder-wave access to all edges of the chip carriers disposed thereon and to substantially prevent the dislodging of the chip carriers by the forces of the solder wave.
    Type: Grant
    Filed: August 5, 1983
    Date of Patent: December 25, 1984
    Assignee: RCA Corporation
    Inventors: Anthony J. Barresi, Leonard Nelson, Jack Pogson