Abstract: A mixture of benzyl alcohol and hydroxy benzene is disclosed, for use in the bonding together of polyamide articles. In embodiments, the mixture comprises 5 to 50% by weight of benzyl alcohol, 20 to 90% by weight of phenol and 5 to 30% by weight of polyamide. In other embodiments, the mixture comprises 20 to 60% by weight of benzyl alcohol, 20 to 60% by weight of ortho-dihydroxy benzene and 20 to 60% by weight of a lower alcohol having one to four carbon atoms. The mixture may be applied to a polyamide article, which may then be contacted with a second polyamide article and heated to effect bonding. In embodiments, the mixture may be applied in a pattern e.g. to polyamide in the form of film, so that a polyamide structure having a similar pattern of bonds may be obtained. For example, the composition may be used to bond film or sheet together so as to form fluid flow passages therebetween e.g. as in a heat exchanger.