Patents by Inventor Anthony J. Davies

Anthony J. Davies has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for multilayer printed circuit board manufacture
    Patent number: 5106454
    Abstract: Process for at least partially dissolving a copper oxide surface layer by contacting the surface layer with one or more copper oxide dissolving compounds. When used in the manufacture of a multilayer printed circuit board, the process improves adhesion between board layers, reduces or eliminates localized delamination of a multilayer board that occurs during through-hole drilling, and eliminates or substantially reduces the occurrence of pink ring.
    Type: Grant
    Filed: November 1, 1990
    Date of Patent: April 21, 1992
    Assignee: Shipley Company Inc.
    Inventors: George R. Allardyce, Anthony J. Davies, David J. Wayness, Amrik Singh