Patents by Inventor Anthony J. Galvan

Anthony J. Galvan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-dimensional printing
    Patent number: 11738508
    Abstract: In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: August 29, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sterling Chaffins, Kevin P DeKam, Kristopher J Erickson, Cory J Ruud, Jami Ryan Barone, Ruhua Cai, Anthony J Galvan
  • THREE-DIMENSIONAL PRINTING
    Publication number: 20200269501
    Abstract: In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.
    Type: Application
    Filed: November 17, 2017
    Publication date: August 27, 2020
    Inventors: STERLING CHAFFINS, KEVIN P DeKAM, KRISTOPHER J ERICKSON, CORY J RUUD, JAMI RYAN BARONE, RUHUA CAI, ANTHONY J GALVAN
  • Stacked adhesive lines
    Patent number: 8863388
    Abstract: A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: October 21, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chris Aschoff, Anthony J. Galvan, Henry Kang, Kelly B. Smith, Lawrence Thurber
  • STACKED ADHESIVE LINES
    Publication number: 20120242757
    Abstract: A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.
    Type: Application
    Filed: March 21, 2011
    Publication date: September 27, 2012
    Inventors: Chris Aschoff, Anthony J. Galvan, Henry Kang, Kelly B. Smith, Lawrence Thurber