Abstract: A process for the electrochemical removal of a metal cover wherein the electrically nonconductive underlying material to be exposed cannot withstand elevated temperatures produced by hot spots or arcs in the material being removed. The item to be processed is first masked, completely covering the area which is to be in contact with the etching solution. Segments of protective maskant are then removed in strips of prescribed width and at specified time intervals to expose additional material. The sequence produces graduated depths in the material being etched away and eventually results in the underlying material being exposed in incremental strips. Appropriate selection of timing and exposure width retains adequate unmasked covering material to avoid local areas of high current density, while insuring a smoothly expanding etched exposure of the underlying material.