Patents by Inventor Anthony J. Strzelczyk

Anthony J. Strzelczyk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid
    Patent number: 8616266
    Abstract: The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. The mechanically flexible substrate may form an internal channel which is configured for containing an electrically-conductive liquid. The thermal spreader may further include a pump. The pump may be configured for being connected to the substrate and for circulating the electrically-conductive liquid within the internal channel. The thermal spreader may further include one or more thermally-conductive, rigid metal inserts. Each insert may be configured for being in thermal contact with the electrically-conductive liquid and the substrate and for promoting heat transfer between the thermal spreader and the electrically-conductive liquid.
    Type: Grant
    Filed: September 12, 2008
    Date of Patent: December 31, 2013
    Assignee: Rockwell Collins, Inc.
    Inventors: Ross K. Wilcoxon, Nathan P. Lower, James R. Wooldridge, David W. Dlouhy, Anthony J. Strzelczyk
  • Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid
    Publication number: 20100065256
    Abstract: The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. The mechanically flexible substrate may form an internal channel which is configured for containing an electrically-conductive liquid. The thermal spreader may further include a pump. The pump may be configured for being connected to the substrate and for circulating the electrically-conductive liquid within the internal channel. The thermal spreader may further include one or more thermally-conductive, rigid metal inserts. Each insert may be configured for being in thermal contact with the electrically-conductive liquid and the substrate and for promoting heat transfer between the thermal spreader and the electrically-conductive liquid.
    Type: Application
    Filed: September 12, 2008
    Publication date: March 18, 2010
    Inventors: Ross K. Wilcoxon, Nathan P. Lower, James R. Wooldridge, David W. Dlouhy, Anthony J. Strzelczyk