Abstract: A lead frame locater is used to locate actual positions of lead frame leads in respect to the semiconductor chip to provide accurate wire bonding of the semiconductor chip to the lead frame leads.

Abstract: A system for producing integrated circuit devices includes first and second integrated circuit processing stations. The first station produces an output stream of individual, separate devices for delivery to the second station. A drum buffer receives the individual devices from the first station, selectively stores the individual devices, and dispenses the stored devices on a substantially last-in first-out basis to the second station. The drum buffer includes a plurality of device carrying channels axially along the length of the drum to receive the devices being selectively stored by filling the respective channels as the drum is rotatably indexed in one direction, and to empty the stored devices from the respective channels as the drum is rotatably indexed in an opposite direction.

Abstract: A system of a plurality of lead frame matrices of standard width to obviate readjustment of matrix handling means of integrated circuit device assembly machinery. A standard width for each lead frame matrix is achieved by incorporating spacing elements into the construction of the lead frame matrices as is necessary to add to the width of the lead frame matrix to bring it up to standard width. The width of a lead frame matrix includes the lead frames along the width, the spacing elements and matrix guide bars.

Abstract: A package for an integrated circuit is provided with interconnected leads within accessable recesses in the enclosure of the package. The interconnections of the leads is severed to isolate each leads from all other leads.

Abstract: An improved braking system comprising inlets imbedded flush with an air track surface with the elongated portions thereof parallel to the direction of wafer travel. The inlets are connected to a controlled vacuum source preferably by means of pressure regulating passageways communicating with both ends of each inlet. When vacuum is applied to the inlets, a traveling wafer passing over and substantially covering the elongated inlets is pulled uniformly and evenly down by vacuum action, so that substantially the entire bottom surface of the wafer contacts the track simultaneously. Thus, the wafer comes to rest at a single position within the braking station, irrespective of the original direction of wafer travel.

Abstract: Disclosed is a multichannel drainage system for separately draining the centrifugally broadcast residue of different liquids sequentially dispensed on the top surface of a semiconductor wafer spun on a spindle at a work station. The multichannel drainage system includes a cup assembly mounted on a cup plate which is raised and lowered by elevator apparatus. The cup assembly has a lower drainage cup forming an annular channel and a first outlet communicating with the channel. An upper drainage cup, stacked atop the lower cup, forms a second annular channel communicating with a second outlet. The elevator apparatus raises or lowers the cup plate under the action of a cam. The cam has a three-stage profile, with each stage corresponding to a stationary position of the cup assembly relative the wafer. In the home position for loading and unloading the wafer, the cup assembly is below the wafer.

Abstract: A semiconductor wafer baking and handling system includes a pair of wheel assemblies each comprising a pair of spaced apart plates having opposed, aligned slots formed therein for receiving and supporting semiconductor wafers. A wafer transporting air track includes portions extending between the plates of both of the wheel assemblies. The wheel assemblies are rotated about axes lying substantially in the plane of and extending perpendicularly to the path of wafer travel along the air track to sequentially position the slots to receive semiconductor wafers, to rotate the received semiconductor wafers through an arc of 180.degree., and to subsequently sequentially position the slots to effect removal of the semiconductor wafers. One of the wheel assemblies is mounted in a housing which also encloses a heater, a fan, and baffles for directing gas from the fan across the heater and across the wafers to effect baking of the wafers.