Patents by Inventor Anthony L. Plachy

Anthony L. Plachy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6391669
    Abstract: Multilayer substrates, are fabricated with the incorporation therein of non-destructive test structures utilized to provide visual and electrical test data to facilitate the ascertainment and assessment of potential electrical interface failures. Furthermore, there are provided embedded structures in multilayer substrates, such as are employed in chip carrier packaging, so as to facilitate electrical testing for via to via alignment and interface layer alignment, and to enable the testing of conductive interface electrical integrity of multilayer electrical devices.
    Type: Grant
    Filed: June 21, 2000
    Date of Patent: May 21, 2002
    Assignee: International Business Machines Corporation
    Inventors: Benjamin V. Fasano, Hai P. Longworth, Vincent P. Peterson, III, Anthony L. Plachy, Robert N. Wiggin
  • Patent number: 5471090
    Abstract: Electrical interconnection structures are described. The electrical interconnection structures are formed by electrically interconnecting in a stack a plurality of discrete substrates. By using a plurality of discrete substrates, a multilayer dielectric/electrical conductor structure can be fabricated from individual discrete substrates each of which can be tested prior to forming a composite stack so that defects in each discrete substrate can be eliminated before inclusion into the stack. Electrical interconnection between adjacent substrate is provided by an array of contact locations on each surface of the adjacent substrates. Corresponding contacts on adjacent substrates are adapted for mutual electrical engagement. Adjacent contact locations can be thermocompression bonded. To reduce the parasitic capacitance and coupled noise between the contact pads and the electrical conductors within the interior of each discrete substrate, the contact pads on each substrate have elongated shape.
    Type: Grant
    Filed: March 8, 1993
    Date of Patent: November 28, 1995
    Assignee: International Business Machines Corporation
    Inventors: Alina Deutsch, David A. Lewis, Chandrasekhar Narayan, Anthony L. Plachy