Abstract: A greeting card assembly having an electronics unit is embedded into the card. Electronics that play a length of music containing consecutive notes that can be selectively played over the speaker. A graphic of at least one instrument is displayed in the card. At least one activation sensor is provided within the graphic. Each activation sensor can be triggered by touching the graphic where the activation sensor is located. When an activation sensor is triggered, the electronics unit plays only one or two notes from the length of music. In this manner, to play the full length of music, the activation sensor must be repeatedly triggered. By strategically positioning the activation sensor in the graphic of the instrument, the repeated triggering of the activation sensor provides the appearance that a user is actually playing the instrument depicted in the graphic.

Abstract: A storage drive assembly is provided. The storage drive assembly includes a storage drive sized and shaped for insertion into a slot within a chassis, a latching mechanism coupled to a first end of the storage drive, the latching mechanism including an actuation component actuable to transition the latching mechanism from a locked state in which the latching mechanism restricts displacement of the storage drive relative to the chassis to an unlocked state in which the latching mechanism enables displacement of the storage drive assembly relative to the chassis, and a drive secure cover plate adapted to removably mate with the latching mechanism in the locked state, the mated drive secure cover plate preventing physical access to the actuation component.

Abstract: Disclosed herein are monoclonal antibodies and antigen-binding fragments thereof capable of selectively inhibiting TGF?1 with high potency. Related compositions, methods and therapeutic use are also disclosed.

Abstract: A computer-implemented method is provided for cooling hard disk drives (HDDs). The method may include determining a threshold fan speed for one or more fans that provide cooling for HDDs based upon a target HDD vibration performance. The method may also include controlling the one or more fans, by a controller, to alternately run at a first fan speed for a first period and at the threshold fan speed for a second period, when the one or more fans reach the threshold fan speed. The first fan speed is higher than the threshold fan speed.

Abstract: A server includes an interface configured to communicate with a vehicle and a charger, and a processor configured to responsive to receiving, from the vehicle, vehicle data indicative of an energy transfer amount from the vehicle to one or more receiving entities above a transfer threshold, impose a limitation on the charger to charge the vehicle by sending a message to the charger.

Abstract: Disclosed are a robot arm control method, a skin surface treatment apparatus, and a computer-readable memory medium, which relate to the field of mechanical control. the robot arm control method includes steps of: demarcating a to-be-treated surface of an object treated by a robot arm into at least two areas of interest; obtaining, by a three-dimensional scanning device, a three-dimensional point cloud corresponding to each area of interest; optimizing respective three-dimensional point clouds; merging the respective three-dimensional point clouds to obtain an executive point cloud; creating a motion path for the robot arm based on the executive point cloud; and performing, by the robot arm, a treatment to the surface of the object based on the motion path. Compared with conventional technologies, the disclosure has a better cost-effectiveness, an enhanced treatment efficiency, and an improved apparatus safety.

Abstract: The invention relates to a 3D pop-up card comprising a plush FIG. (3) reversibly convertible from a flat compressed state to a three-dimensional expanded state, and a foldable base (5) reversibly convertible from a flat compressed state to a three-dimensional expanded state, and a foldable card (2) having an inner side and an outer side, which is reversibly transferable from a folded closed state to an unfolded opened state, wherein the foldable base (5) is fixed to the inner side of the foldable card (2) and wherein the plush FIG. (3) is fixed to the foldable base (5), and wherein the card (2) comprises an additional support element (6) which is arranged inside the base (5) and supports the base (5) from the inside in the unfolded state of the card (2).

Abstract: Disclosed are a robot arm control method, a skin surface treatment apparatus, and a computer-readable memory medium, which relate to the field of mechanical control. the robot arm control method includes steps of: demarcating a to-be-treated surface of an object treated by a robot arm into at least two areas of interest; obtaining, by a three-dimensional scanning device, a three-dimensional point cloud corresponding to each area of interest; optimizing respective three-dimensional point clouds; merging the respective three-dimensional point clouds to obtain an executive point cloud; creating a motion path for the robot arm based on the executive point cloud; and performing, by the robot arm, a treatment to the surface of the object based on the motion path. Compared with conventional technologies, the disclosure has a better cost-effectiveness, an enhanced treatment efficiency, and an improved apparatus safety.

Abstract: Techniques of transaction support for a database are disclosed herein. One example technique includes generating a new version value for key-value pairs in the database and creating, in the database, a new key-value pair corresponding to a parameter to be updated with a new value using both the generated new version value and a name of the parameter as a key and the new value as the corresponding value for the created new key-value pair. The example technique can then include determining whether creating the new key-value pair is completed successfully in the database, and in response to determining that creating the new key-value pair corresponding to the parameter is not completed successfully, the existing value of the parameter is returned as a current value of the parameter instead of the new value in response to a query for the current value of the parameter.

Abstract: An assembly and method for delivery of an analyte sensor including a reusable applicator having a proximal portion and a distal portion are disclosed. The reusable applicator can include a housing, a sensor carrier configured to releasably receive the first analyte sensor, a sharp carrier configured to releasably receive a sharp module, and an actuator movable relative to the housing.

Abstract: An assembly and method for delivery of an analyte sensor including a reusable applicator having a proximal portion and a distal portion are disclosed. The reusable applicator can include a housing, a sensor carrier configured a sensor carrier configured to releasably receive a first analyte sensor, a sharp carrier configured to releasably receive a sharp module and movable between the proximal portion of the reusable applicator and the distal portion of the reusable applicator for delivery of the first analyte sensor from the reusable applicator, and a reset tool configured to reset the reusable applicator for delivery of another analyte sensor.

Abstract: Techniques of transaction support for a database are disclosed herein. One example technique includes generating a new version value for key-value pairs in the database and creating, in the database, a new key-value pair corresponding to a parameter to be updated with a new value using both the generated new version value and a name of the parameter as a key and the new value as the corresponding value for the created new key-value pair. The example technique can then include determining whether creating the new key-value pair is completed successfully in the database, and in response to determining that creating the new key-value pair corresponding to the parameter is not completed successfully, the existing value of the parameter is returned as a current value of the parameter instead of the new value in response to a query for the current value of the parameter.

Abstract: A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; and a chemical delivery mechanism configured in the processing chamber to provide a chemical to a reaction zone in the processing chamber. The chemical delivery mechanism includes an edge chemical injector, a first radial chemical injector, and a second radial chemical injector configured on three sides of the reaction zone.

Abstract: A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; and a chemical delivery mechanism configured in the processing chamber to provide a chemical to a reaction zone in the processing chamber. The chemical delivery mechanism includes an edge chemical injector, a first radial chemical injector, and a second radial chemical injector configured on three sides of the reaction zone.

Abstract: A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and air edge mechanisms configured on both sides of the first reaction zone to isolate the first reaction zone from other reaction zones in the processing chamber.

Abstract: A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and air edge mechanisms configured on both sides of the first reaction zone to isolate the first reaction zone from other reaction zones in the processing chamber.

Abstract: A semiconductor fabrication apparatus includes a processing chamber, a wafer stage configured in the processing chamber, a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber, and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector both configured to deliver the second chemical to the second reaction zone.

Abstract: A semiconductor fabrication apparatus includes a processing chamber, a wafer stage configured in the processing chamber, a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber, and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector both configured to deliver the second chemical to the second reaction zone.

Abstract: The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a processing chamber; a wafer stage configured in the processing chamber, the wafer stage is operable to secure and rotate a plurality of wafers around an axis; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector.

Abstract: The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a processing chamber; a wafer stage configured in the processing chamber, the wafer stage is operable to secure and rotate a plurality of wafers around an axis; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector.