Abstract: Techniques of transaction support for a database are disclosed herein. One example technique includes generating a new version value for key-value pairs in the database and creating, in the database, a new key-value pair corresponding to a parameter to be updated with a new value using both the generated new version value and a name of the parameter as a key and the new value as the corresponding value for the created new key-value pair. The example technique can then include determining whether creating the new key-value pair is completed successfully in the database, and in response to determining that creating the new key-value pair corresponding to the parameter is not completed successfully, the existing value of the parameter is returned as a current value of the parameter instead of the new value in response to a query for the current value of the parameter.

Abstract: Techniques of transaction support for a database are disclosed herein. One example technique includes generating a new version value for key-value pairs in the database and creating, in the database, a new key-value pair corresponding to a parameter to be updated with a new value using both the generated new version value and a name of the parameter as a key and the new value as the corresponding value for the created new key-value pair. The example technique can then include determining whether creating the new key-value pair is completed successfully in the database, and in response to determining that creating the new key-value pair corresponding to the parameter is not completed successfully, the existing value of the parameter is returned as a current value of the parameter instead of the new value in response to a query for the current value of the parameter.

Abstract: A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; and a chemical delivery mechanism configured in the processing chamber to provide a chemical to a reaction zone in the processing chamber. The chemical delivery mechanism includes an edge chemical injector, a first radial chemical injector, and a second radial chemical injector configured on three sides of the reaction zone.

Abstract: A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; and a chemical delivery mechanism configured in the processing chamber to provide a chemical to a reaction zone in the processing chamber. The chemical delivery mechanism includes an edge chemical injector, a first radial chemical injector, and a second radial chemical injector configured on three sides of the reaction zone.

Abstract: A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and air edge mechanisms configured on both sides of the first reaction zone to isolate the first reaction zone from other reaction zones in the processing chamber.

Abstract: A semiconductor fabrication apparatus includes a processing chamber; a wafer stage configured in the processing chamber; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and air edge mechanisms configured on both sides of the first reaction zone to isolate the first reaction zone from other reaction zones in the processing chamber.

Abstract: A semiconductor fabrication apparatus includes a processing chamber, a wafer stage configured in the processing chamber, a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber, and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector both configured to deliver the second chemical to the second reaction zone.

Abstract: A semiconductor fabrication apparatus includes a processing chamber, a wafer stage configured in the processing chamber, a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber, and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector both configured to deliver the second chemical to the second reaction zone.

Abstract: The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a processing chamber; a wafer stage configured in the processing chamber, the wafer stage is operable to secure and rotate a plurality of wafers around an axis; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector.

Abstract: The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a processing chamber; a wafer stage configured in the processing chamber, the wafer stage is operable to secure and rotate a plurality of wafers around an axis; a first chemical delivery mechanism configured in the processing chamber to provide a first chemical to a first reaction zone in the processing chamber; and a second chemical delivery mechanism configured in the processing chamber to provide a second chemical to a second reaction zone in the processing chamber. The second chemical delivery mechanism includes an edge chemical injector and a first radial chemical injector.

Abstract: The present invention provides a portable security policy and environment, which can accompany a user conveniently, wherever the user goes. The portable security policy and environment involves authenticating the identity of a client end, checking the security environment of the client end, generating policy based on the security environment, and delivering policy to network devices.

Abstract: The present invention provides a portable security policy and environment, which can accompany a user conveniently, wherever the user goes. The portable security policy and environment involves authenticating the identity of a client end, checking the security environment of the client end, generating policy based on the security environment, and delivering policy to network devices.