Patents by Inventor Anthony LoBianco
Anthony LoBianco has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150255402Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.Type: ApplicationFiled: May 25, 2015Publication date: September 10, 2015Inventors: Dinhphuoc V. HOANG, Thomas E. NOLL, Anil K. AGARWAL, Robert W. WARREN, Matthew S. READ, Anthony LOBIANCO
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Publication number: 20150255403Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.Type: ApplicationFiled: May 25, 2015Publication date: September 10, 2015Inventors: Dinhphuoc V. HOANG, Thomas E. NOLL, Anil K. AGARWAL, Robert W. WARREN, Matthew S. READ, Anthony LOBIANCO
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Patent number: 9054115Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.Type: GrantFiled: December 5, 2011Date of Patent: June 9, 2015Assignee: Skyworks Solutions, Inc.Inventors: Dinhphuoc V. Hoang, Thomas E. Noll, Anil K. Agarwal, Robert W. Warren, Matthew S. Read, Anthony LoBianco
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Patent number: 9041168Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.Type: GrantFiled: December 5, 2011Date of Patent: May 26, 2015Assignee: Skyworks Solutions, Inc.Inventors: Dinhphuoc V. Hoang, Thomas E. Noll, Anil K. Agarwal, Robert W. Warren, Matthew S. Read, Anthony LoBianco
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Patent number: 8399972Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.Type: GrantFiled: August 4, 2006Date of Patent: March 19, 2013Assignee: Skyworks Solutions, Inc.Inventors: Dinhphuoc V. Hoang, Thomas E. Noll, Anil K. Agarwal, Robert W. Warren, Matthew S. Read, Anthony LoBianco
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Publication number: 20120146178Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.Type: ApplicationFiled: December 5, 2011Publication date: June 14, 2012Applicant: Skyworks Solutions, Inc.Inventors: Dinhphuoc V. Hoang, Thomas E. Noll, Anil K. Agarwal, Robert W. Warren, Matthew S. Read, Anthony LoBianco
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Publication number: 20120137514Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.Type: ApplicationFiled: December 5, 2011Publication date: June 7, 2012Applicant: Skyworks Solution, Inc.Inventors: Dinhphuoc V. Hoang, Thomas E. Noll, Anil K. Agarwal, Robert W. Warren, Matthew S. Read, Anthony LoBianco
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Patent number: 8071431Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.Type: GrantFiled: December 16, 2010Date of Patent: December 6, 2011Assignee: Skyworks Solutions, Inc.Inventors: Dinphuoc V. Hoang, Thomas E. Noll, Anil K. Agarwal, Robert W. Warren, Matthew S. Read, Anthony LoBianco
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Publication number: 20110084368Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.Type: ApplicationFiled: December 16, 2010Publication date: April 14, 2011Applicant: SKYWORKS SOLUTIONS, INC.Inventors: Dinphuoc V. Hoang, Thomas E. Noll, Anil K. Agarwal, Robert W. Warren, Matthew S. Read, Anthony LoBianco
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Patent number: 7696064Abstract: A through via is constructed in a two-stage process. A void in a portion of the depth of the substrate is filled from a first surface of the semiconductor substrate creating an enclosed volume within the substrate. Thereafter, the enclosed volume is exposed and the remaining portion of the void is filled.Type: GrantFiled: October 11, 2007Date of Patent: April 13, 2010Assignee: Skyworks Solutions, Inc.Inventors: Qing Gan, Anthony LoBianco
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Publication number: 20090267220Abstract: Single-die or multi-die packaged modules that incorporate three-dimensional integration of active devices with discrete passive devices to create a package structure that allows active devices (such as, silicon or gallium-arsenide devices) to share the same footprint area as an array of passive surface mount components. In one example, a module includes at least one active device stacked on top of an array of passive surface mount components on a substrate. A conductive or non-conductive adhesive can be used to adhere the active device to the array of passive devices.Type: ApplicationFiled: April 23, 2008Publication date: October 29, 2009Inventors: Mark A. Kuhlman, Anthony LoBianco, Thomas Noll, Robert W. Warren
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Publication number: 20090127695Abstract: A substrate pad in a semiconductor package having a geometry and structure that facilitates providing a solder joint to the pad that has enhanced structural integrity and resistance to mechanical impact. The pad may include a plated metal stud that anchors the solder to the pad interface, providing a more compliant solder joint, even when lead-free solder is used.Type: ApplicationFiled: November 19, 2007Publication date: May 21, 2009Inventors: Patrick Kim, Mark A. Kuhlman, Yifan Guo, Anthony LoBianco, Robert W. Warren
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Publication number: 20090098731Abstract: A through via is constructed in a two-stage process. A void in a portion of the depth of the substrate is filled from a first surface of the semiconductor substrate creating an enclosed volume within the substrate. Thereafter, the enclosed volume is exposed and the remaining portion of the void is filled.Type: ApplicationFiled: October 11, 2007Publication date: April 16, 2009Inventors: Qing Gan, Anthony LoBianco
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Publication number: 20080064142Abstract: According to an exemplary embodiment, a method for fabricating a wafer level package includes forming a polymer layer on a device wafer, where the device wafer includes at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The method further includes bonding a protective wafer to the device wafer. The method further includes forming at least one via in the protective wafer, where the at least one via extends through the protective wafer and is situated over the at least one device wafer contact pad. The method further includes forming at least one protective wafer contact pad on the protective wafer, where the at least one protective wafer contact pad is situated over the at least one via and electrically connected to the at least one device wafer contact pad.Type: ApplicationFiled: October 26, 2007Publication date: March 13, 2008Inventors: QING GAN, ANTHONY LOBIANCO, ROBERT WARREN
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Publication number: 20080003761Abstract: According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.Type: ApplicationFiled: September 7, 2007Publication date: January 3, 2008Inventors: Qing Gan, Robert Warren, Anthony Lobianco, Steve Liang
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Publication number: 20070241440Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.Type: ApplicationFiled: August 4, 2006Publication date: October 18, 2007Inventors: Dinhphuoc Hoang, Thomas Noll, Anil Agarwal, Robert Warren, Matthew Read, Anthony LoBianco
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Publication number: 20060220173Abstract: According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.Type: ApplicationFiled: April 1, 2005Publication date: October 5, 2006Inventors: Qing Gan, Robert Warren, Anthony Lobianco, Steve Liang
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Publication number: 20060211233Abstract: According to an exemplary embodiment, a method for fabricating a wafer level package includes forming a polymer layer on a device wafer, where the device wafer includes at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The method further includes bonding a protective wafer to the device wafer. The method further includes forming at least one via in the protective wafer, where the at least one via extends through the protective wafer and is situated over the at least one device wafer contact pad. The method further includes forming at least one protective wafer contact pad on the protective wafer, where the at least one protective wafer contact pad is situated over the at least one via and electrically connected to the at least one device wafer contact pad.Type: ApplicationFiled: March 21, 2005Publication date: September 21, 2006Inventors: Qing Gan, Anthony Lobianco, Robert Warren
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Patent number: 6596212Abstract: A simple, inexpensive method and apparatus are provided for increasing the thickness of a body molded on a semiconductor package without the need for a new mold, or for reworking the parts of an existing mold. The method includes providing a mold having parts that engage each other at respective interfacial surfaces, and a shim having a selected thickness and an opening through an interior portion thereof. The shim is interposed between the interfacial surfaces of the mold parts such that the mold parts are spaced apart by the thickness of the shim, and such that the mold parts and the shim opening define a cavity in the mold. The length and width of the cavity of the mold thus remain the same, while the height of the cavity, and hence, the thickness of the molded body, is increased by the thickness of the shim.Type: GrantFiled: March 20, 2000Date of Patent: July 22, 2003Assignee: Amkor Technology, Inc.Inventors: Anthony LoBianco, Jonathon Greenwood