Abstract: A first package for an integrated circuit has both a first set of electrical contacts and a first connector. A second package has a second set of electrical contacts and a second connector. The first and the second connector are mating connectors that are electrically and physically coupled. The first set of electrical contacts and the first connector are disposed on opposite surfaces of the first package and the second set of electrical contacts and the second connector are disposed on the same surface of the second package. The first and second set of electrical contacts couple to a printed circuit board directly or indirectly through a socket. The connectors allow higher speed signals to be routed over the first and second connectors, while power, ground and slower speed signals can be routed over the first set and second set of electrical contacts.

Abstract: A conductive plane of an integrated circuit package and a heatsink combine to form a structure for controlling electromagnetic emissions from the integrated circuit die that is mounted in the package. The heatsink includes a base and a projecting portion extending from the base. The projecting portion is electrically connected to an exposed ground plane in the package. The projecting portion defines a recess positioned over the integrated circuit die, which thermally engages the integrated circuit die.