Patents by Inventor Anthony M. Aulicino

Anthony M. Aulicino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate-holding fixture of non-wettable material
    Patent number: 6030889
    Abstract: A method for forming solder ball contacts on a Ball Grid Array (BGA) is described. The solder balls are formed by squeegeeing solder paste through apertures in a fixture into contact with pads on a substrate, and heating the fixture, paste and substrate to reflow the solder paste into solder balls that attach to the pads and are detached from the fixture. After cooling, the fixture is readily separated from the substrate while leaving the solder balls in positive (conductive) contact with contact pads on the substrate.
    Type: Grant
    Filed: May 20, 1997
    Date of Patent: February 29, 2000
    Assignee: International Business Machines Corporation
    Inventors: Anthony M. Aulicino, Robert J. Lyn
  • Method for forming solder balls on a substrate
    Patent number: 5658827
    Abstract: A method for forming solder ball contacts on a Ball Grid Array (BGA) is described. The solder balls are formed by squeegeeing solder paste through apertures in a fixture into contact with pads on a substrate, and heating the fixture, paste and substrate to reflow the solder paste into solder balls that attach to the pads and are detached from the fixture. After cooling, the fixture is readily separated from the substrate while leaving the solder balls in positive (conductive) contact with contact pads on the substrate.
    Type: Grant
    Filed: October 31, 1995
    Date of Patent: August 19, 1997
    Assignee: International Business Machines Corporation
    Inventors: Anthony M. Aulicino, Robert J. Lyn