Patents by Inventor Anthony M. Chasensky

Anthony M. Chasensky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190183472
    Abstract: A medical device system for delivering a neuromodulation therapy includes a delivery tool for deploying an implantable medical device at a neuromodulation therapy site. The implantable medical device includes a housing, an electronic circuit within the housing, and an electrical lead comprising a lead body extending between a proximal end coupled to the housing and a distal end extending away from the housing and at least one electrode carried by the lead body. The delivery tool includes a first cavity for receiving the housing and a second cavity for receiving the lead. The first cavity and the second cavity are in direct communication for receiving and deploying the housing and the lead coupled to the housing concomitantly as a single unit.
    Type: Application
    Filed: February 21, 2019
    Publication date: June 20, 2019
    Inventors: Brad C. Tischendorf, Eric H. Bonde, Phillip C. Falkner, John E. Kast, Randy S. Roles, Erik R. Scott, Todd V. Smith, Xuan K. Wei, Anthony M. Chasensky, Michael J. Ebert, Shawn C. Kelley, Gabriela C. Molnar, Richard T. Stone
  • Publication number: 20190126028
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Application
    Filed: December 26, 2018
    Publication date: May 2, 2019
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Patent number: 10258789
    Abstract: A medical device system for delivering a neuromodulation therapy includes a delivery tool for deploying an implantable medical device at a neuromodulation therapy site. The implantable medical device includes a housing, an electronic circuit within the housing, and an electrical lead comprising a lead body extending between a proximal end coupled to the housing and a distal end extending away from the housing and at least one electrode carried by the lead body. The delivery tool includes a first cavity for receiving the housing and a second cavity for receiving the lead. The first cavity and the second cavity are in direct communication for receiving and deploying the housing and the lead coupled to the housing concomitantly as a single unit.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: April 16, 2019
    Assignee: MEDTRONIC, INC.
    Inventors: Brad C. Tischendorf, Eric H. Bonde, Phillip C. Falkner, John E. Kast, Randy S. Roles, EriK R. Scott, Todd V. Smith, Xuan K. Wei, Anthony M. Chasensky, Michael J. Ebert, Shawn C. Kelley, Gabriela C. Molnar, Richard T. Stone
  • Patent number: 10201335
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: February 12, 2019
    Assignee: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Publication number: 20180168564
    Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
    Type: Application
    Filed: February 20, 2018
    Publication date: June 21, 2018
    Inventors: Brad C. Tischendorf, Eric H. Bonde, Phillip C. Falkner, John E. Kast, Randy S. Roles, Erik R. Scott, Todd V. Smith, Xuan K. Wei, Anthony M. Chasensky, Michael J. Ebert, Shawn C. Kelley, Gabriela C. Molnar, Richard T. Stone
  • Patent number: 9931107
    Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: April 3, 2018
    Assignee: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, Eric H. Bonde, Phillip C. Falkner, John E. Kast, Randy S. Roles, Erik R. Scott, Todd V. Smith, Xuan K. Wei, Anthony M. Chasensky, Michael J. Ebert, Shawn C. Kelley, Gabriela C. Molnar, Richard T. Stone
  • Publication number: 20160331978
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Application
    Filed: July 25, 2016
    Publication date: November 17, 2016
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Patent number: 9398901
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: July 26, 2016
    Assignee: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Publication number: 20140163580
    Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
    Type: Application
    Filed: December 6, 2013
    Publication date: June 12, 2014
    Applicant: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, Eric H. Bonde, Phillip C. Falkner, John E. Kast, Randy S. Roles, Erik R. Scott, Todd V. Smith, Xuan K. Wei, Anthony M. Chasensky, Michael J. Ebert, Shawn C. Kelley, Gabriela C. Molnar, Richard T. Stone
  • Publication number: 20140163579
    Abstract: A medical device system for delivering a neuromodulation therapy includes a delivery tool for deploying an implantable medical device at a neuromodulation therapy site. The implantable medical device includes a housing, an electronic circuit within the housing, and an electrical lead comprising a lead body extending between a proximal end coupled to the housing and a distal end extending away from the housing and at least one electrode carried by the lead body. The delivery tool includes a first cavity for receiving the housing and a second cavity for receiving the lead. The first cavity and the second cavity are in direct communication for receiving and deploying the housing and the lead coupled to the housing concomitantly as a single unit.
    Type: Application
    Filed: December 6, 2013
    Publication date: June 12, 2014
    Applicant: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, Eric H. Bonde, Phillip C. Falkner, John E. Kast, Randy S. Roles, EriK R. Scott, Todd V. Smith, Xuan K. Wei, Anthony M. Chasensky, Michael J. Ebert, Shawn C. Kelley, Gabriela C. Molnar, Richard T. Stone
  • Publication number: 20140163646
    Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
    Type: Application
    Filed: December 6, 2013
    Publication date: June 12, 2014
    Applicant: Medtronic, Inc.
    Inventors: Brad C. Tischendorf, John E. Kast, Thomas P. Miltich, Gordon O. Munns, Randy S. Roles, Craig L. Schmidt, Joseph J. Viavattine, Christian S. Nielsen, Prabhakar A. Tamirisa, Anthony M. Chasensky, Markus W. Reiterer, Chris J. Paidosh, Reginald D. Robinson, Bernard Q. Li, Erik R. Scott, Phillip C. Falkner, Xuan K. Wei, Eric H. Bonde
  • Patent number: 8376206
    Abstract: A cold weld is formed in a multilayer-material. A first pin is coupled to a first block. A second pin is coupled to a second block. The multilayer material is disposed between the first pin and the second pin. The first pin opposes the second pin. The multilayer material is held in the XY plane and floats in the Z axis.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: February 19, 2013
    Assignee: Medtronic, Inc.
    Inventors: Christian S. Nielsen, Timothy T. Bomstad, Anthony M. Chasensky
  • Publication number: 20120125978
    Abstract: A cold weld is formed in a multilayer-material. A first pin is coupled to a first block. A second pin is coupled to a second block. The multilayer material is disposed between the first pin and the second pin. The first pin opposes the second pin. The multilayer material is held in the XY plane and floats in the Z axis.
    Type: Application
    Filed: October 18, 2011
    Publication date: May 24, 2012
    Applicant: Medtronic, Inc.
    Inventors: Christian S. NIELSEN, Timothty T. BOMSTAD, Anthony M. CHASENSKY
  • Patent number: 8038048
    Abstract: A cold weld is formed in a multilayer material. A first pin is coupled to a first block. A second pin is coupled to a second block. The multilayer material is disposed between the first pin and the second pin. The first pin opposes the second pin. The multilayer material is held in the XY plane and floats in the Z axis.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: October 18, 2011
    Assignee: Medtronic, Inc.
    Inventors: Christian S. Nielsen, Timothy T. Bomstad, Anthony M. Chasensky