Patents by Inventor ANTHONY M. CONSTANTINE
ANTHONY M. CONSTANTINE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12650945Abstract: A memory module adapter card can adapt multiple compression-attached memory modules (CAMMs) to a dual inline memory module (DIMM) connector. Multiplexer circuitry on the adapter card enables multiplexing data amongst the memory modules attached to the adapter card during a same burst access sequence.Type: GrantFiled: July 26, 2022Date of Patent: June 9, 2026Assignee: Intel CorporationInventors: George Vergis, Xiang Li, Jun Liao, Anthony M. Constantine, Min Suet Lim, Tongyan Zhai, Konika Ganguly
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Patent number: 12588149Abstract: Methods and apparatus for GDDR (Graphics Double Date Rate) memory expander using compression mount technology (CMT) connectors. A CMT connector with a dedicated pinout for GDDR-based memory is provided that enables end users and manufacturers to change the amount of GDDR memory provided with a GPU card, accelerator card, or apparatus having other form factors. Memory could also be replaced in the event of a failure. In addition, embodiments are disclosed that support a split channel concept where there could be multiple devices (e.g., GDDR modules) with dedicated signals routed to each module.Type: GrantFiled: July 22, 2022Date of Patent: March 24, 2026Assignee: Intel CorporationInventors: Xiang Li, Konika Ganguly, Tongyan Zhai, George Vergis, Anthony M. Constantine, Jun Liao
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Publication number: 20230007775Abstract: Methods and apparatus for GDDR (Graphics Double Date Rate) memory expander using compression mount technology (CMT) connectors. A CMT connector with a dedicated pinout for GDDR-based memory is provided that enables end users and manufacturers to change the amount of GDDR memory provided with a GPU card, accelerator card, or apparatus having other form factors. Memory could also be replaced in the event of a failure. In addition, embodiments are disclosed that support a split channel concept where there could be multiple devices (e.g., GDDR modules) with dedicated signals routed to each module.Type: ApplicationFiled: July 22, 2022Publication date: January 5, 2023Inventors: Xiang LI, Konika GANGULY, Tongyan ZHAI, George VERGIS, Anthony M. CONSTANTINE, Jun LIAO
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Publication number: 20220368047Abstract: An adapter card with compression-attached memory modules that can be inserted into a conventional vertical connector enables use of CAMMs in systems with vertical memory module connectors. In one example, an adapter card or riser card includes a printed circuit board (PCB) having an edge to be received by a dual-inline memory module (DIMM) connector. First conductive contacts proximate to the edge of the PCB are to be received by the DIMM connector, enabling the first conductive contacts to couple with contacts of the DIMM connector. Second conductive contacts on a face of the PCB are to couple with a first compression attached memory module (CAMM) via a first compression mount technology (CMT) connector. The adapter card includes conductive traces on or in the PCB between the first conductive contacts and the second conductive contacts to couple the CAMM with the DIMM connector.Type: ApplicationFiled: July 26, 2022Publication date: November 17, 2022Inventors: George VERGIS, Xiang LI, Jun LIAO, Anthony M. CONSTANTINE, Min Suet LIM, Tongyan ZHAI, Konika GANGULY
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Publication number: 20220360002Abstract: Methods and apparatus for differential I/O (input/output) cards using compression mount technology (CMT) connectors. Assemblies include a CMT connector having an array of spring-loaded pins or contacts that are configured to contact respective CMT contact pads on a pair of printed circuit board (PCBs), such as an add-in card (AIC) and a motherboard. Stacked assemblies are also disclosed including multiple CMT AIC or PCIe modules communicatively coupled using on module CMT connectors. The connector solutions may be used for AICs without changing the overall PCB form factor outline of existing AICs employing edge connectors. Under a stacked assembly of multiple CMT PCIe modules interconnected by on module CMT connectors, wiring in the PCBs is configured to provide signaling supporting multi-lane PCIe or CXL links for each CMT PCIe module. The CMT connector approach also is scalable and can support more pins/contacts to facilitate additional I/O bandwidth.Type: ApplicationFiled: July 22, 2022Publication date: November 10, 2022Inventors: Xiang LI, Konika GANGULY, Tongyan ZHAI, George VERGIS, Anthony M. CONSTANTINE, Jun LIAO
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Publication number: 20220358072Abstract: A memory module adapter card can adapt multiple compression-attached memory modules (CAMMs) to a dual inline memory module (DIMM) connector. Multiplexer circuitry on the adapter card enables multiplexing data amongst the memory modules attached to the adapter card during a same burst access sequence.Type: ApplicationFiled: July 26, 2022Publication date: November 10, 2022Inventors: George VERGIS, Xiang LI, Jun LIAO, Anthony M. CONSTANTINE, Min Suet LIM, Tongyan ZHAI, Konika GANGULY
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Publication number: 20220361328Abstract: Power conversion modules using compression mount technology (CMT) connectors and associated apparatus and methods. Assemblies include a CMT connector that includes an array of spring-loaded CMT pins or contacts that are configured to contact respective pads on a pair of printed circuit board (PCBs), such as for VR module card or power conversion module and a motherboard. The power conversion modules in combination with the CMT connectors provide several advantages, including, a common VR module/power conversion module/motherboard footprint across OEM platforms and test hardware, just in time VR module attachment for improved inventory management, removable power delivery solution makes the platform more conducive to debug, in field servicing, and platform upgradable for higher power CPU/GPU/XPU.Type: ApplicationFiled: July 22, 2022Publication date: November 10, 2022Inventors: Xiang LI, Konika GANGULY, Tongyan ZHAI, George VERGIS, Anthony M. CONSTANTINE, Jun LIAO
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Publication number: 20220069497Abstract: An apparatus includes a rigid housing, a first connector coupled to the housing, the first connector to receive an edge connector of an input/output (I/O) device, and a second connector coupled to the housing, the second connector to couple to an edge connector socket. Pairs of electrical connection pins of the first connector are coupled to respective pairs of electrical connection pins of the second connector via shielded differential cables inside the housing.Type: ApplicationFiled: November 11, 2021Publication date: March 3, 2022Applicant: Intel CorporationInventors: Xiang Li, Anthony M. Constantine, Jingbo Li
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Patent number: 10628367Abstract: Examples include techniques for dynamically modifying a platform form factor of a mobile device. In some examples, a system may include a split memory array having a first memory within a docking system and a second memory element within a small form factor (SFF) mobile device. A platform form factor determination component may dynamically select between multiple platform form factors based on a determination that the SFF mobile device is coupled with the docking system. An interface logic component may access the first memory storage of the docking system during a memory (e.g., graphics) computation when the mobile device is physically and electrically/communicably coupled with the docking system to allow the SFF mobile device to have full LFF functionality. When the SFF mobile device is disconnected from the docking system, the interface logic component may access only the second memory storage of the SFF mobile device to provide SFF functionality.Type: GrantFiled: December 28, 2016Date of Patent: April 21, 2020Assignee: INTEL CORPORATIONInventors: Tawfik M. Rahal-Arabi, Prashant Sethi, Anthony M. Constantine, Yu-Liang Shiao, Chang-Wu Yen
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Patent number: 10551897Abstract: Provided are devices, systems and methods relating to controller interactions with storage. One embodiment includes an apparatus comprising a controller for communication with a storage device through a signal line, wherein the controller is configured to detect a first signal on the signal line indicating the presence of the storage device on the signal line, and provide a second signal on the signal line to reset the storage device after a detection that the first signal indicates the presence of the storage device. Other embodiments are described and claimed.Type: GrantFiled: September 28, 2017Date of Patent: February 4, 2020Assignee: INTEL CORPORATIONInventors: Myron D. Loewen, Andrew W. Morning-Smith, Anthony M. Constantine
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Patent number: 10509759Abstract: Provided are an apparatus, system, and method relating to detecting, during a system boot operation, whether a device arranged to implement a first bus interface protocol is coupled to a system through a connector. A bus clock is programmed to be off in response to detection of no device implementing the first bus interface protocol being coupled to the system through the connector. After the bus clock is programmed to be off, a buffer is reprogrammed to assume that the connector implements a second bus interface protocol coupled to a storage device. After reprogramming the buffer, the apparatus, system, and method detect whether a device arranged to implement the second bus interface protocol is coupled to the connector, and the device arranged to implement the second bus interface protocol is initialized in response to detection that the device is coupled to the connector. Other embodiments are described and claimed.Type: GrantFiled: March 31, 2017Date of Patent: December 17, 2019Assignee: INTEL CORPORATIONInventors: Daniel S. Willis, Anthony M. Constantine
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Patent number: 10409737Abstract: Provided are apparatus, system, and method for positionally aware device management bus address assignment. A presence of a plurality of storage devices is detected on a bus. One of the storage devices detected on the bus is selected. A get identifier command is sent on the bus to all of the storage devices that is only responded to by the selected storage device. A unique identifier is received from the selected storage device over the bus. An address for the selected storage device is assigned and an entry is added to the address mapping to indicate the unique identifier, the assigned address, and a physical location indicator for the selected storage device.Type: GrantFiled: September 8, 2017Date of Patent: September 10, 2019Assignee: INTEL CORPORATIONInventors: Myron D. Loewen, Andrew W. Morning-Smith, Anthony M. Constantine
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Patent number: 10304814Abstract: An apparatus is described. The apparatus includes a package on package structure. The package on package structure includes an upper package and a lower package. One of the packages contain memory devices of a first type and the other of the packages contain memory devices of a second type. I/O connections on the underside of the upper package's substrate are vertically aligned with their corresponding, first I/O connections on the underside of the lower package's substrate. The first I/O connections are located outside second I/O connections on the underside of the lower package's substrate for the lower package.Type: GrantFiled: June 30, 2017Date of Patent: May 28, 2019Assignee: Intel CorporationInventors: Konika Ganguly, Robert J. Royer, Jr., Rebecca Z. Loop, Anthony M. Constantine, Bilal Khalaf
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Publication number: 20190006340Abstract: An apparatus is described. The apparatus includes a package on package structure. The package on package structure includes an upper package and a lower package. One of the packages contain memory devices of a first type and the other of the packages contain memory devices of a second type. I/O connections on the underside of the upper package's substrate are vertically aligned with their corresponding, first I/O connections on the underside of the lower package's substrate. The first I/O connections are located outside second I/O connections on the underside of the lower package's substrate for the lower package.Type: ApplicationFiled: June 30, 2017Publication date: January 3, 2019Inventors: Konika GANGULY, Robert J. ROYER, JR., Rebecca Z. LOOP, Anthony M. CONSTANTINE, Bilal KHALAF
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Publication number: 20180356872Abstract: Provided are devices, systems and methods relating to controller interactions with storage. One embodiment includes an apparatus comprising a controller for communication with a storage device through a signal line, wherein the controller is configured to detect a first signal on the signal line indicating the presence of the storage device on the signal line, and provide a second signal on the signal line to reset the storage device after a detection that the first signal indicates the presence of the storage device. Other embodiments are described and claimed.Type: ApplicationFiled: September 28, 2017Publication date: December 13, 2018Inventors: Myron D. LOEWEN, Andrew W. MORNING-SMITH, Anthony M. CONSTANTINE
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Publication number: 20180357187Abstract: Provided are apparatus, system, and method for positionally aware device management bus address assignment. A presence of a plurality of storage devices is detected on a bus. One of the storage devices detected on the bus is selected. A get identifier command is sent on the bus to all of the storage devices that is only responded to by the selected storage device. A unique identifier is received from the selected storage device over the bus. An address for the selected storage device is assigned and an entry is added to the address mapping to indicate the unique identifier, the assigned address, and a physical location indicator for the selected storage device.Type: ApplicationFiled: September 8, 2017Publication date: December 13, 2018Inventors: Myron D. LOEWEN, Andrew W. MORNING-SMITH, Anthony M. CONSTANTINE
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Publication number: 20180285307Abstract: Provided are an apparatus, system, and method relating to detecting, during a system boot operation, whether a device arranged to implement a first bus interface protocol is coupled to a system through a connector. A bus clock is programmed to be off in response to detection of no device implementing the first bus interface protocol being coupled to the system through the connector. After the bus clock is programmed to be off, a buffer is reprogrammed to assume that the connector implements a second bus interface protocol coupled to a storage device. After reprogramming the buffer, the apparatus, system, and method detect whether a device arranged to implement the second bus interface protocol is coupled to the connector, and the device arranged to implement the second bus interface protocol is initialized in response to detection that the device is coupled to the connector. Other embodiments are described and claimed.Type: ApplicationFiled: March 31, 2017Publication date: October 4, 2018Inventors: Daniel S. WILLIS, Anthony M. CONSTANTINE
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Publication number: 20180181527Abstract: Examples include techniques for dynamically modifying a platform form factor of a mobile device. In some examples, a system may include a split memory array having a first memory within a docking system and a second memory element within a small form factor (SFF) mobile device. A platform form factor determination component may dynamically select between multiple platform form factors based on a determination that the SFF mobile device is coupled with the docking system. An interface logic component may access the first memory storage of the docking system during a memory (e.g., graphics) computation when the mobile device is physically and electrically/communicably coupled with the docking system to allow the SFF mobile device to have full LFF functionality. When the SFF mobile device is disconnected from the docking system, the interface logic component may access only the second memory storage of the SFF mobile device to provide SFF functionality.Type: ApplicationFiled: December 28, 2016Publication date: June 28, 2018Applicant: INTEL CORPORATIONInventors: TAWFIK M. RAHAL-ARABI, PRASHANT SETHI, ANTHONY M. CONSTANTINE, YU-LIANG SHIAO, CHANG-WU YEN