Patents by Inventor ANTHONY M. CONSTANTINE

ANTHONY M. CONSTANTINE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12650945
    Abstract: A memory module adapter card can adapt multiple compression-attached memory modules (CAMMs) to a dual inline memory module (DIMM) connector. Multiplexer circuitry on the adapter card enables multiplexing data amongst the memory modules attached to the adapter card during a same burst access sequence.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: June 9, 2026
    Assignee: Intel Corporation
    Inventors: George Vergis, Xiang Li, Jun Liao, Anthony M. Constantine, Min Suet Lim, Tongyan Zhai, Konika Ganguly
  • Patent number: 12588149
    Abstract: Methods and apparatus for GDDR (Graphics Double Date Rate) memory expander using compression mount technology (CMT) connectors. A CMT connector with a dedicated pinout for GDDR-based memory is provided that enables end users and manufacturers to change the amount of GDDR memory provided with a GPU card, accelerator card, or apparatus having other form factors. Memory could also be replaced in the event of a failure. In addition, embodiments are disclosed that support a split channel concept where there could be multiple devices (e.g., GDDR modules) with dedicated signals routed to each module.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 24, 2026
    Assignee: Intel Corporation
    Inventors: Xiang Li, Konika Ganguly, Tongyan Zhai, George Vergis, Anthony M. Constantine, Jun Liao
  • Publication number: 20230007775
    Abstract: Methods and apparatus for GDDR (Graphics Double Date Rate) memory expander using compression mount technology (CMT) connectors. A CMT connector with a dedicated pinout for GDDR-based memory is provided that enables end users and manufacturers to change the amount of GDDR memory provided with a GPU card, accelerator card, or apparatus having other form factors. Memory could also be replaced in the event of a failure. In addition, embodiments are disclosed that support a split channel concept where there could be multiple devices (e.g., GDDR modules) with dedicated signals routed to each module.
    Type: Application
    Filed: July 22, 2022
    Publication date: January 5, 2023
    Inventors: Xiang LI, Konika GANGULY, Tongyan ZHAI, George VERGIS, Anthony M. CONSTANTINE, Jun LIAO
  • Publication number: 20220368047
    Abstract: An adapter card with compression-attached memory modules that can be inserted into a conventional vertical connector enables use of CAMMs in systems with vertical memory module connectors. In one example, an adapter card or riser card includes a printed circuit board (PCB) having an edge to be received by a dual-inline memory module (DIMM) connector. First conductive contacts proximate to the edge of the PCB are to be received by the DIMM connector, enabling the first conductive contacts to couple with contacts of the DIMM connector. Second conductive contacts on a face of the PCB are to couple with a first compression attached memory module (CAMM) via a first compression mount technology (CMT) connector. The adapter card includes conductive traces on or in the PCB between the first conductive contacts and the second conductive contacts to couple the CAMM with the DIMM connector.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 17, 2022
    Inventors: George VERGIS, Xiang LI, Jun LIAO, Anthony M. CONSTANTINE, Min Suet LIM, Tongyan ZHAI, Konika GANGULY
  • Publication number: 20220360002
    Abstract: Methods and apparatus for differential I/O (input/output) cards using compression mount technology (CMT) connectors. Assemblies include a CMT connector having an array of spring-loaded pins or contacts that are configured to contact respective CMT contact pads on a pair of printed circuit board (PCBs), such as an add-in card (AIC) and a motherboard. Stacked assemblies are also disclosed including multiple CMT AIC or PCIe modules communicatively coupled using on module CMT connectors. The connector solutions may be used for AICs without changing the overall PCB form factor outline of existing AICs employing edge connectors. Under a stacked assembly of multiple CMT PCIe modules interconnected by on module CMT connectors, wiring in the PCBs is configured to provide signaling supporting multi-lane PCIe or CXL links for each CMT PCIe module. The CMT connector approach also is scalable and can support more pins/contacts to facilitate additional I/O bandwidth.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 10, 2022
    Inventors: Xiang LI, Konika GANGULY, Tongyan ZHAI, George VERGIS, Anthony M. CONSTANTINE, Jun LIAO
  • Publication number: 20220358072
    Abstract: A memory module adapter card can adapt multiple compression-attached memory modules (CAMMs) to a dual inline memory module (DIMM) connector. Multiplexer circuitry on the adapter card enables multiplexing data amongst the memory modules attached to the adapter card during a same burst access sequence.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 10, 2022
    Inventors: George VERGIS, Xiang LI, Jun LIAO, Anthony M. CONSTANTINE, Min Suet LIM, Tongyan ZHAI, Konika GANGULY
  • Publication number: 20220361328
    Abstract: Power conversion modules using compression mount technology (CMT) connectors and associated apparatus and methods. Assemblies include a CMT connector that includes an array of spring-loaded CMT pins or contacts that are configured to contact respective pads on a pair of printed circuit board (PCBs), such as for VR module card or power conversion module and a motherboard. The power conversion modules in combination with the CMT connectors provide several advantages, including, a common VR module/power conversion module/motherboard footprint across OEM platforms and test hardware, just in time VR module attachment for improved inventory management, removable power delivery solution makes the platform more conducive to debug, in field servicing, and platform upgradable for higher power CPU/GPU/XPU.
    Type: Application
    Filed: July 22, 2022
    Publication date: November 10, 2022
    Inventors: Xiang LI, Konika GANGULY, Tongyan ZHAI, George VERGIS, Anthony M. CONSTANTINE, Jun LIAO
  • Publication number: 20220069497
    Abstract: An apparatus includes a rigid housing, a first connector coupled to the housing, the first connector to receive an edge connector of an input/output (I/O) device, and a second connector coupled to the housing, the second connector to couple to an edge connector socket. Pairs of electrical connection pins of the first connector are coupled to respective pairs of electrical connection pins of the second connector via shielded differential cables inside the housing.
    Type: Application
    Filed: November 11, 2021
    Publication date: March 3, 2022
    Applicant: Intel Corporation
    Inventors: Xiang Li, Anthony M. Constantine, Jingbo Li
  • Patent number: 10628367
    Abstract: Examples include techniques for dynamically modifying a platform form factor of a mobile device. In some examples, a system may include a split memory array having a first memory within a docking system and a second memory element within a small form factor (SFF) mobile device. A platform form factor determination component may dynamically select between multiple platform form factors based on a determination that the SFF mobile device is coupled with the docking system. An interface logic component may access the first memory storage of the docking system during a memory (e.g., graphics) computation when the mobile device is physically and electrically/communicably coupled with the docking system to allow the SFF mobile device to have full LFF functionality. When the SFF mobile device is disconnected from the docking system, the interface logic component may access only the second memory storage of the SFF mobile device to provide SFF functionality.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: April 21, 2020
    Assignee: INTEL CORPORATION
    Inventors: Tawfik M. Rahal-Arabi, Prashant Sethi, Anthony M. Constantine, Yu-Liang Shiao, Chang-Wu Yen
  • Patent number: 10551897
    Abstract: Provided are devices, systems and methods relating to controller interactions with storage. One embodiment includes an apparatus comprising a controller for communication with a storage device through a signal line, wherein the controller is configured to detect a first signal on the signal line indicating the presence of the storage device on the signal line, and provide a second signal on the signal line to reset the storage device after a detection that the first signal indicates the presence of the storage device. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: February 4, 2020
    Assignee: INTEL CORPORATION
    Inventors: Myron D. Loewen, Andrew W. Morning-Smith, Anthony M. Constantine
  • Patent number: 10509759
    Abstract: Provided are an apparatus, system, and method relating to detecting, during a system boot operation, whether a device arranged to implement a first bus interface protocol is coupled to a system through a connector. A bus clock is programmed to be off in response to detection of no device implementing the first bus interface protocol being coupled to the system through the connector. After the bus clock is programmed to be off, a buffer is reprogrammed to assume that the connector implements a second bus interface protocol coupled to a storage device. After reprogramming the buffer, the apparatus, system, and method detect whether a device arranged to implement the second bus interface protocol is coupled to the connector, and the device arranged to implement the second bus interface protocol is initialized in response to detection that the device is coupled to the connector. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: December 17, 2019
    Assignee: INTEL CORPORATION
    Inventors: Daniel S. Willis, Anthony M. Constantine
  • Patent number: 10409737
    Abstract: Provided are apparatus, system, and method for positionally aware device management bus address assignment. A presence of a plurality of storage devices is detected on a bus. One of the storage devices detected on the bus is selected. A get identifier command is sent on the bus to all of the storage devices that is only responded to by the selected storage device. A unique identifier is received from the selected storage device over the bus. An address for the selected storage device is assigned and an entry is added to the address mapping to indicate the unique identifier, the assigned address, and a physical location indicator for the selected storage device.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: September 10, 2019
    Assignee: INTEL CORPORATION
    Inventors: Myron D. Loewen, Andrew W. Morning-Smith, Anthony M. Constantine
  • Patent number: 10304814
    Abstract: An apparatus is described. The apparatus includes a package on package structure. The package on package structure includes an upper package and a lower package. One of the packages contain memory devices of a first type and the other of the packages contain memory devices of a second type. I/O connections on the underside of the upper package's substrate are vertically aligned with their corresponding, first I/O connections on the underside of the lower package's substrate. The first I/O connections are located outside second I/O connections on the underside of the lower package's substrate for the lower package.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: May 28, 2019
    Assignee: Intel Corporation
    Inventors: Konika Ganguly, Robert J. Royer, Jr., Rebecca Z. Loop, Anthony M. Constantine, Bilal Khalaf
  • Publication number: 20190006340
    Abstract: An apparatus is described. The apparatus includes a package on package structure. The package on package structure includes an upper package and a lower package. One of the packages contain memory devices of a first type and the other of the packages contain memory devices of a second type. I/O connections on the underside of the upper package's substrate are vertically aligned with their corresponding, first I/O connections on the underside of the lower package's substrate. The first I/O connections are located outside second I/O connections on the underside of the lower package's substrate for the lower package.
    Type: Application
    Filed: June 30, 2017
    Publication date: January 3, 2019
    Inventors: Konika GANGULY, Robert J. ROYER, JR., Rebecca Z. LOOP, Anthony M. CONSTANTINE, Bilal KHALAF
  • Publication number: 20180356872
    Abstract: Provided are devices, systems and methods relating to controller interactions with storage. One embodiment includes an apparatus comprising a controller for communication with a storage device through a signal line, wherein the controller is configured to detect a first signal on the signal line indicating the presence of the storage device on the signal line, and provide a second signal on the signal line to reset the storage device after a detection that the first signal indicates the presence of the storage device. Other embodiments are described and claimed.
    Type: Application
    Filed: September 28, 2017
    Publication date: December 13, 2018
    Inventors: Myron D. LOEWEN, Andrew W. MORNING-SMITH, Anthony M. CONSTANTINE
  • Publication number: 20180357187
    Abstract: Provided are apparatus, system, and method for positionally aware device management bus address assignment. A presence of a plurality of storage devices is detected on a bus. One of the storage devices detected on the bus is selected. A get identifier command is sent on the bus to all of the storage devices that is only responded to by the selected storage device. A unique identifier is received from the selected storage device over the bus. An address for the selected storage device is assigned and an entry is added to the address mapping to indicate the unique identifier, the assigned address, and a physical location indicator for the selected storage device.
    Type: Application
    Filed: September 8, 2017
    Publication date: December 13, 2018
    Inventors: Myron D. LOEWEN, Andrew W. MORNING-SMITH, Anthony M. CONSTANTINE
  • Publication number: 20180285307
    Abstract: Provided are an apparatus, system, and method relating to detecting, during a system boot operation, whether a device arranged to implement a first bus interface protocol is coupled to a system through a connector. A bus clock is programmed to be off in response to detection of no device implementing the first bus interface protocol being coupled to the system through the connector. After the bus clock is programmed to be off, a buffer is reprogrammed to assume that the connector implements a second bus interface protocol coupled to a storage device. After reprogramming the buffer, the apparatus, system, and method detect whether a device arranged to implement the second bus interface protocol is coupled to the connector, and the device arranged to implement the second bus interface protocol is initialized in response to detection that the device is coupled to the connector. Other embodiments are described and claimed.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 4, 2018
    Inventors: Daniel S. WILLIS, Anthony M. CONSTANTINE
  • Publication number: 20180181527
    Abstract: Examples include techniques for dynamically modifying a platform form factor of a mobile device. In some examples, a system may include a split memory array having a first memory within a docking system and a second memory element within a small form factor (SFF) mobile device. A platform form factor determination component may dynamically select between multiple platform form factors based on a determination that the SFF mobile device is coupled with the docking system. An interface logic component may access the first memory storage of the docking system during a memory (e.g., graphics) computation when the mobile device is physically and electrically/communicably coupled with the docking system to allow the SFF mobile device to have full LFF functionality. When the SFF mobile device is disconnected from the docking system, the interface logic component may access only the second memory storage of the SFF mobile device to provide SFF functionality.
    Type: Application
    Filed: December 28, 2016
    Publication date: June 28, 2018
    Applicant: INTEL CORPORATION
    Inventors: TAWFIK M. RAHAL-ARABI, PRASHANT SETHI, ANTHONY M. CONSTANTINE, YU-LIANG SHIAO, CHANG-WU YEN