Abstract: An emergency stairwell for a building having multiple floors comprising: at least one landing associated with each the floor, each landing increasing in width in at least one horizontal direction from an uppermost landing of an upper floor to a lowermost landing of a lower floor; and at least one set of stairs extending between adjacent pairs of landings.

Abstract: An emergency stairwell for a building having multiple floors comprising: at least one landing associated with each the floor, each landing increasing in width in at least one horizontal direction from an uppermost landing of an upper floor to a lowermost landing of a lower floor; and at least one set of stairs extending between adjacent pairs of landings.

Abstract: Redundant chip sections held in standby are substituted for chip sections that are at risk of over heating based on certain sensor signals. When these signals are received operations of the chip section at risk IS transferred to a redundant chip section and the chip section at risk is shut down. After the original chip section has cooled, it becomes available as a replacement chip section itself. The sensor signals may be based on temperature values, elapsed operation time, and number or rate of operations within a chip section.

Abstract: A monolithic probe having an integral fine probe point, pressure spring, conductive line, and connector for contacting semiconductor devices to be tested and a method of construction of said probe is described. Integration of a serpentine spring into the probe body reduces breakage and improves contact reliability. Standard, coaxial, triaxial, and Kelvin probes are described. The methods of construction described utilize standard semiconductor processes. The probes may be fabricated to very small dimensions.

Abstract: A monolithic probe having an integral fine probe point, pressure spring, conductive line, and connector for contacting semiconductor devices to be tested and a method of construction of said probe is described. Integration of a serpentine spring into the probe body reduces breakage and improves contact reliability. Standard, coaxial, triaxial, and Kelvin probes are described. The methods of construction described utilize standard semiconductor processes. The probes may be fabricated to very small dimensions.

Abstract: An electrically activated fuse with a high melting point heater element in series with a low melting point fusible link. The heater element has a higher resistivity and larger cross-sectional area than the fusible link in order to withstand heat that the heater element generates bringing the fusible link to its melting point. Fuse dimensions (width and length) are each between 0.1 and 2.0 microns, with a thermal mass of the heater element being sufficient to melt the fusible link.

Abstract: An electrically activated fuse with a high melting point heater element in series with a low melting point fusible link. The heater element has a higher resistivity and larger cross-sectional area than the fusible link in order to withstand heat that the heater element generates bringing the fusible link to its melting point. Fuse dimensions (width and length) are each between 0.1 and 2.0 microns, with a thermal mass of the heater element being sufficient to melt the fusible link.

Abstract: Disclosed is a method and apparatus for polishing a semiconductor wafer. This invention describes a novel in situ method for eliminating residual slurry and slurry abrasive particles on the wafer. A reactant is added to the slurry during the end of the Chemical Mechanical Polish (CMP) process to dissolve the slurry and etch the abrasive particles.

Abstract: A structure (and method) for selectively making an electrical connection comprising a conductive element, wherein the conductive element becomes non-conductive after application of radiation energy, and a reflective element, positioned adjacent at least two sides of the conductive element for reflecting the radiation energy.

Abstract: A heat dissipation apparatus for cooling one or more electronic devices. The apparatus utilizes a moving heat sink a portion of which is in contact with the device to be cooled. The moving heat sink may be in the form of a rotating disk, moving belt or strip. The heat sink may be made from various materials such as metals or plastics.

Abstract: A semiconductor device which includes a first semiconductor chip mounted on top of a lead frame which is molded within a plastic body. During the molding process a cavity is formed on the bottom of the lead frame. After testing or burn-in of the first chip a second semiconductor chip is mounted and electrically connected to the lead frame. The second chip may then be sealed within the cavity to form a multichip module.

Abstract: A chemical, mechanical polisher having a plurality of cylindrical rollers rotating orthogonally to a rotating work piece that they wipe and cover that are conditioned to uniformly receive a cleaning agent for polishing the work piece.

Abstract: A planarizing system which significantly reduces the problems associated with non-uniform removal of surface material across the face of a semiconductor wafer or other comparable workpiece. The invention involves a planarizing apparatus that takes the leading edge of a wafer out of contact with the polishing pad while concomitantly enhancing slurry penetration and distribution at the polishing pad-wafer interface. This result is accomplished by combining: means for deflecting upward a portion of a flexible polishing pad as it passes in rotation beneath a wafer to form a raised polishing pad area, and means for positioning the wafer such that the wafer's leading edge overhangs the front edge of the raised polishing pad area during the planarization procedure. The invention also encompasses a method of using the planarizing apparatus to uniformly remove surface material across the face of a wafer.

Abstract: Disclosed is a method and apparatus for polishing a semiconductor wafer. This invention describes a novel in situ method for eliminating residual slurry and slurry abrasive particles on the wafer. A reactant is added to the slurry during the end of the Chemical Mechanical Polish (CMP) process to dissolve the slurry and etch the abrasive particles.

Abstract: A planarizing system which significantly reduces the problems associated with non-uniform removal of surface material across the face of a semiconductor wafer or other comparable workpiece. The invention involves a planarizing apparatus that takes the leading edge of a wafer out of contact with the polishing pad while concomitantly enhancing slurry penetration and distribution at the polishing pad-wafer interface. This result is accomplished by combining: means for deflecting upward a portion of a flexible polishing pad as it passes in rotation beneath a wafer to form a raised polishing pad area, and means for positioning the wafer such that the wafer's leading edge overhangs the front edge of the raised polishing pad area during the planarization procedure. The invention also encompasses a method of using the planarizing apparatus to uniformly remove surface material across the face of a wafer.

Abstract: A packaging scheme for a stack of semiconductor chips that is light weight and has better cooling and mechanical and electrical protection than that hitherto provided for. The stack of semiconductor chips are connected to a wiring interface. Separating each of the chips from any adjacent chip is a supporting, insulating interposer. Each interposer electrically insulates each chip from any adjacent chip while mechanically protecting the chip supported thereby. The interposers are the cantilevered shelves of a rack and they prevent undue mechanical movement of the chips while still permitting for convection cooling of the chips. An hermetically sealed enclosure around the stack of chips, can be provided with a cooling fluid therein and completes the package. In another arrangement, the rack is itself is provided with circuitry which may be coupled to the chips positioned and supported therein.