Abstract: A carrier for packaged integrated circuit chips with an impact resistant carrying strip which has a plurality of equidistantly spaced square apertures and is contained in plastic shipping tubes. Ceramic Pin Grid Array (CPGA) Modules are carried on the strip with the module's pins protected in pin cavities or aperatures in the carrying strip. Bumpers prevent adjacent modules from chipping each other. A specially designed shipping tube encloses the carrying strip for additional handling protection. The strip also serves to facilitate automated assembly. Anti-static or static sensitive materials may be used for either the tube or the strip or for both.