Patents by Inventor Anthony Matthew DeLugan

Anthony Matthew DeLugan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat transfer interfaces for circuit card assembly (CCA) modules
    Patent number: 11839061
    Abstract: An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: December 5, 2023
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Alexander Trotman, Judy Schwartz, Josh Kamp, Robert J. DeFelice, Michael Doe, Jr., Anthony Matthew DeLugan
  • Circuit card assembly (CCA) module thermal interface devices
    Patent number: 11825633
    Abstract: An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: November 21, 2023
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Alexander Trotman, Josh Kamp, Judy Schwartz, Robert DeFelice, Michael Doe, Jr., Anthony Matthew DeLugan
  • HEAT TRANSFER INTERFACES FOR CIRCUIT CARD ASSEMBLY (CCA) MODULES
    Publication number: 20230345676
    Abstract: An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.
    Type: Application
    Filed: April 25, 2022
    Publication date: October 26, 2023
    Applicant: Hamilton Sundstrand Corporation
    Inventors: Alexander Trotman, Judy Schwartz, Josh Kamp, Robert J. DeFelice, Michael Doe, Jr., Anthony Matthew DeLugan
  • HEAT TRANSFER INTERFACES FOR CIRCUIT CARD ASSEMBLY (CCA) MODULES
    Publication number: 20230262917
    Abstract: An electronic module assembly includes a circuit card assembly (CCA) including heat generating electronic components. A connector is electrically connected to the heat generating electronic components. The connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA and is connected in thermal communication with the electronic components. A wedge feature is defined along a lateral edge of the heatsink relative to the connector.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 17, 2023
    Applicant: Hamilton Sundstrand Corporation
    Inventors: Alexander Trotman, Josh Kamp, Judy Schwartz, Robert DeFelice, Michael Doe, JR., Anthony Matthew DeLugan
  • CIRCUIT CARD ASSEMBLY (CCA) MODULE THERMAL INTERFACE DEVICES
    Publication number: 20230262941
    Abstract: An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 17, 2023
    Applicant: Hamilton Sundstrand Corporation (HSC)
    Inventors: Alexander Trotman, Josh Kamp, Judy Schwartz, Robert DeFelice, Michael Doe, JR., Anthony Matthew DeLugan