Abstract: Articles of manufacture, machines, processes for using the articles and machines, processes for making the articles and machines, and products produced by the process of making, along with necessary intermediates, directed to a scanning camera system.

Abstract: Articles of manufacture, machines, processes for using the articles and machines, processes for making the articles and machines, and products produced by the process of making, along with necessary intermediates, directed to a scanning camera system.

Abstract: A device for shaving and dispensing material therefrom. The shaving device has a shaving head removably attached to a handle. The shaving head includes at least one blade to allow a user to cut hair. The handle has an internal cavity, wherein the internal cavity can be separated into two parts to allow insertion of a capsule containing a dispensable material, such as shaving cream or aftershave. The handle includes an opening adjacent to the shaving head and an outlet at the opposing end of the handle. The opening and the outlet allow the material from the capsule to be dispensed therethrough. The dispensable material may be dispensed at will by the user.

Abstract: A device for shaving and dispensing material therefrom. The shaving device has a shaving head removably attached to a handle. The shaving head includes at least one blade to allow a user to cut hair. The handle has an internal cavity, wherein the internal cavity can be separated into two parts to allow insertion of a capsule containing a dispensable material, such as shaving cream or aftershave. The handle includes an opening adjacent to the shaving head and an outlet at the opposing end of the handle. The opening and the outlet allow the material from the capsule to be dispensed therethrough. The dispensable material may be dispensed at will by the user.

Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.

Abstract: A hermetically sealed optical transmitter module for use in an optical transceiver converting and coupling an information-containing electrical signal with an optical fiber. A plurality of semiconductor lasers are provided on a common support in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal according to a standardized optical communications protocol, such as the IEEE 802.3ae 10 Gigabit BASE LX4 physical layer.

Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.

Abstract: A modular, hermetically sealed optical signal receiver subassembly for converting a modulated optical signal to a corresponding electrical signal including an optical demultiplexer coupled to a fiber optic connector receiving a multi-wavelength optical signal having a plurality of information-containing signals each with a different predetermined wavelength and functioning to demultiplex the optical signal into distinct first and second optical beams corresponding to the predetermined wavelength and substrate is provided that forms an optional reference path of the first and second beams respectively, the photodiodes functioning to convert the respective optical signals into an electrical signal.

Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.

Abstract: A hermetically sealed optical transmitter module for use in an optical transceiver converting and coupling an information-containing electrical signal with an optical fiber. A plurality of semiconductor lasers are provided on a common support in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal according to a standardized optical communications protocol, such as the IEEE 802.3ae 10 Gigabit BASE LX4 physical layer.

Abstract: Fiber optic connections are accomplished with passive alignment using a modular approach. An improved waveguide substrate has precisely aligned waveguides secured in place, including at an inlet channel, an outlet channel, or both. The waveguides need not extend beyond the face of the inlet or outlet location, and there is no need to have any unsupported fiber optic fibers connect to the waveguide substrate. When provided, a connector module or modules have fiber optic fibers having supported ends which precisely align with the waveguides of the waveguide substrate. Connecting pins typically are provided to insure alignment between waveguides and fibers is easily attained.

Abstract: A modular, hermetically sealed optical signal receiver subassembly for converting a modulated optical signal to a corresponding electrical signal including an optical demultiplexer coupled to a fiber optic connector receiving a multi-wavelength optical signal having a plurality of information-containing signals each with a different predetermined wavelength and functioning to demultiplex the optical signal into distinct first and second optical beams corresponding to the predetermined wavelength and substrate is provided that forms an optional reference path of the first and second beams respectively, the photodiodes functioning to convert the respective optical signals into an electrical signal.

Abstract: An optical transceiver converting and coupling an information-containing electrical signal with an optical fiber including a housing conforming to the industry standard XENPAK™ form factor including an electrical connector for coupling with an external electrical cable or information system device and for transmitting and/or receiving an information-containing electrical communications signal, and a fiber optic connector adapted for coupling with an external optical fiber for transmitting and/or receiving an optical communications signal. At least one electro-optical subassembly is provided in the housing for converting between an information-containing electrical signal and a modulated optical signal corresponding to the electrical signal, along with a modular, interchangeable communications protocol processing printed circuit board in the housing for processing the communications signal into a predetermined electrical or optical communications protocol, such as the IEEE 802.