Abstract: An improved system and method for circuit edit or repair within multilayer structures comprising a large number of layers including layers with thicknesses of 20 nanometers or even less, for example less than 10 nanometers or 8 nanometers, are capable of an advanced end-pointing of a milling operation within the large number of layers, including of end-pointing of the thin layers without unnecessarily damaging the multilayer structure.

Abstract: A micro-tooling device, such as, for example, a scanning electron microscope or a focused-ion beam microscope, provides images. A first machine-learning algorithm and a second machine-learning algorithm are sequentially coupled. The first machine-learning algorithm determines a progress along a predefined workflow based on feature recognition in images associated with the workflow. The second machine-learning algorithm predicts settings of operational parameters of the micro-tooling device in accordance with the progress along the predefined workflow.

Abstract: A micro-tooling device, such as, for example, a scanning electron microscope or a focused-ion beam microscope, provides images. A first machine-learning algorithm and a second machine-learning algorithm are sequentially coupled. The first machine-learning algorithm determines a progress along a predefined workflow based on feature recognition in images associated with the workflow. The second machine-learning algorithm predicts settings of operational parameters of the micro-tooling device in accordance with the progress along the predefined workflow.