Patents by Inventor Anthony Odejar

Anthony Odejar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame
    Patent number: 6576491
    Abstract: A lead frame includes a first side rail, a second side rail spaced apart from the first side rail, a center rail disposed between the first side rail and the second side rail, and a plurality of package locations. Each package location includes a first and a second die attach paddle. The first die attach paddle supports a first side of a semiconductor die and is coupled only to the first side rail or to the second side rail. The second die attach paddle supports a second side of the semiconductor die and is coupled only to the center rail. The first and second die attach paddles are separate and unconnected to each other and may be generally circular in shape. An aggregate surface area of the first and second paddles may be less than about 25 percent of a surface area of the semiconductor die.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: June 10, 2003
    Assignee: Cypress Semiconductor Corporation
    Inventors: Bo Soon Chang, Vani Verma, Anthony Odejar
  • High reliability lead frame and packaging technology containing the same
    Patent number: 6331728
    Abstract: A lead frame includes a first side rail, a second side rail spaced apart from the first side rail, a center rail disposed between the first side rail and the second side rail, and a plurality of package locations. Each package location includes a first and a second die attach paddle. The first die attach paddle supports a first side of a semiconductor die and is coupled only to the first side rail or to the second side rail. The second die attach paddle supports a second side of the semiconductor die and is coupled only to the center rail. The first and second die attach paddles are separate and unconnected to each other and may be generally circular in shape. An aggregate surface area of the first and second paddles may be less than about 25 percent of a surface area of the semiconductor die.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: December 18, 2001
    Assignee: Cypress Semiconductor Corporation
    Inventors: Bo Soon Chang, Vani Verma, Anthony Odejar