Abstract: A new class of thermoelectric and energy conversion apparatus, that enhances the efficiency of converting one form of energy to another using a wide range of energy conversion materials. The new method of stimulating greater electrical conversion using polymers and thermoelectric composite materials that have unique properties similar to commercial superconductors. The invention entails processes that create and interconnect the superconducting polymer layers through an assembly lowering internal resistance, impeding phonon conduction and stimulating increase in electron flow through the device with increased electrical power. The invention includes the use of dopants that are mixed with a polymer solution to build superconducting polymer connections between the thermoelectric device layers.

Abstract: There are two parts to build fusion carbon metal interconnects. First are the fusing metals/alloys, typically in the Martensite phase and lacking carbon. Second are carbonized materials that have carbon infused. These carbonized materials may be referred to as carbon donating materials. Both parts can be interchanged as the substrate or mounted component, or the parts can form linear interface connections. The finished interfaces have very low electrical resistance and/or zero interface electrical resistance. The interconnect circuit topography materials and connections are endless and is dependent on circuit design. One example of such interface is a solderless thermoelectric device capable of use at higher operating temperatures as compared to conventional low temperature solders thus allowing the thermoelectric device to be used in a Seebeck device, for example. The thermoelectric device forms a fusion layer between a copper metal layer and a semiconductor wafer layer to create a true metallurgical bond.

Abstract: A new class of thermoelectric and energy conversion apparatus, that enhances the efficiency of converting one form of energy to another using a wide range of energy conversion materials. The new method of stimulating greater electrical conversion using polymers and thermoelectric composite materials that have unique properties similar to commercial superconductors. The invention entails processes that create and interconnect the superconducting polymer layers through an assembly lowering internal resistance, impeding phonon conduction and stimulating increase in electron flow through the device with increased electrical power. The invention includes the use of dopants that are mixed with a polymer solution to build superconducting polymer connections between the thermoelectric device layers.

Abstract: A solderless thermoelectric device is capable of use at higher operating temperatures as compared to conventional low temperature solders thus allowing the thermoelectric device to be used in a Seebeck device, for example. The thermoelectric device forms a fusion layer between a copper metal layer and a semiconductor wafer layer by impregnating and surface coating graphene on the semiconductor wafer and heating, under pressure, the graphene coated semiconductor wafer to create a true metallurgical bond of the layers with superconducting interfaces and good thermoelectric properties.