Patents by Inventor Anthony Paul Ingraham
Anthony Paul Ingraham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6414509Abstract: A method of testing semiconductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip carrier is provided. The chip carrier has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into conductive contact with the conductor pads on the chip carrier. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing, the chip may be removed from the substrate. Alternatively, the chip may be bonded through the dendritic conductor pads to the substrate after successful testing.Type: GrantFiled: May 3, 2000Date of Patent: July 2, 2002Assignee: International Business Machines CorporationInventors: Anilkumar Chinuprasad Bhatt, Leo Raymond Buda, Robert Douglas Edwards, Paul Joseph Hart, Anthony Paul Ingraham, Voya Rista Markovich, Jaynal Abedin Molla, Richard Gerald Murphy, George John Saxenmeyer, Jr., George Frederick Walker, Bette Jaye Whalen, Richard Stuart Zarr
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Patent number: 6150255Abstract: According to the present invention a technique for providing a planarized substrate with dendritic connections of solder balls, especially a multi-layer ceramic substrate is provided. In the case where the substrate has a raised central portion on the top surface on which are disposed top surface metallurgy pads, a layer of conformable photoimagable material is placed over the top surface.The photoimagable material is exposed and developed in a pattern corresponding to the pattern of the top surface metallurgy pads to form vias in the photoimagable material. Copper is plated in the vias in contact with the top surface metallurgy pads. The exposed surface of the photoimagable surface is then planarized, preferably by mechanical polishing to form a flat planar surface, with the ends of the vias exposed. Dendritic connector pads are then grown on the exposed ends of the vias to which solder ball connections of an I/C chip are releasably connected.Type: GrantFiled: August 13, 1999Date of Patent: November 21, 2000Assignee: International Business Machines CorporationInventors: Francis Joseph Downes, Jr., Stephen Joseph Fuerniss, Gary Ray Hill, Anthony Paul Ingraham, Voya Rista Markovich, Jaynal Abedin Molla
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Patent number: 5994910Abstract: An apparatus, and a corresponding method, for stress-testing wire bond-type semiconductor chips is disclosed. The apparatus includes a clamp housing, with a spring-loaded screw extending through the top end of the housing. Contained within the clamp housing is a substantially rigid, electrically insulating base plate positioned at a lower end of the clamp housing. The upper surface of the base plate includes a depression which contains an insert fabricated either from an elastomeric material or a semiconductor material, such as silicon. A flexible, electrically insulating layer made from, for example, polyimide, overlies the base plate and insert. Significantly, the upper surface of the flexible, electrically insulating layer includes a plurality of dendritic contacts. It is through these dendritic contacts that electrical contact is made to the contact pads of a wire bond-type semiconductor chip.Type: GrantFiled: September 24, 1998Date of Patent: November 30, 1999Assignee: International Business Machines CorporationInventors: Francis Joseph Downes, Jr., Anthony Paul Ingraham, Jaynal Abedin Molla
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Patent number: 5940729Abstract: According to the present invention a technique for providing a planarized substrate with dendritic connections of solder balls, especially a multi-layer ceramic substrate is provided. In the case where the substrate has a raised central portion on the top surface on which are disposed top surface metallurgy pads, a layer of conformable photoimagable material is placed over the top surface.The photoimagable material is exposed and developed in a pattern corresponding to the pattern of the top surface metallurgy pads to form vias in the photoimagable material. Copper is plated in the vias in contact with the top surface metallurgy pads. The exposed surface of the photoimagable surface is then planarized, preferably by mechanical polishing to form a flat planar surface, with the ends of the vias exposed. Dendritic connector pads are then grown on the exposed ends of the vias to which solder ball connections of an I/C chip are releasably connected.Type: GrantFiled: April 17, 1996Date of Patent: August 17, 1999Assignee: International Business Machines Corp.Inventors: Francis Joseph Downes, Jr., Stephen Joseph Fuerniss, Gary Ray Hill, Anthony Paul Ingraham, Voya Rista Markovich, Jaynal Abedin Molla
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Patent number: 5759046Abstract: A technique of connecting a first member having a first face to a second member having a second face utilizing dendrites is provided. Dendrites are formed on one face of the first member in a given configuration. Dendrite receiving and securing material, preferably solder, is formed on a face of the second member in a configuration confirming substantially to the given configuration of the dendrites on the one face. The first and second members are then placed in a position relative to each other with the dendrites on the one face of the first member in contact with the dendrite receiving and engaging material on the face of the second member. An airtight seal is then provided between the first and second faces surrounding the dendrites and dendrite receiving and engaging material, which forms a sealed chamber between the first and second members.Type: GrantFiled: December 30, 1996Date of Patent: June 2, 1998Assignee: International Business Machines CorporationInventors: Anthony Paul Ingraham, Jaynal Abedin Molla, David Brian Stone
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Patent number: 5709336Abstract: A dendrite surface is provided on each of the electrical contacts of a substrate, such as a test board, chip carrier, or printed wiring board. The electrical contacts on the substrate are arranged in a mirror image of the input/output pads on a wirebond chip from which the wire leads have been removed from, or not initially provided on, each of the input/output pads. The wirebond chip is aligned with the substrate, and the respective contact brought into electrical communication with each other. The wirebond chip may be removed after testing or other temporary attachment purpose, or permanently encapsulated with at least a portion of the substrate in a permanent assembly. The present invention permits wirebond chips to be selectively attached temporarily or permanently, i.e., have a pluggable capability, as well as the ability to allow a full array of I/O pad design.Type: GrantFiled: May 31, 1996Date of Patent: January 20, 1998Assignee: International Business Machines CorporationInventors: Anthony Paul Ingraham, William Tze-You Chen
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Patent number: 5672980Abstract: A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.Type: GrantFiled: February 15, 1996Date of Patent: September 30, 1997Assignee: International Business Machines CorporationInventors: Richard Gordon Charlton, George Charles Correia, Mark Andrew Couture, Gary Ray Hill, Kibby Barth Horsford, Anthony Paul Ingraham, Michael David Lowell, Voya Rista Markovich, Gordon Charles Osborne, Jr., Mark Vincent Pierson
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Patent number: 5659256Abstract: A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.Type: GrantFiled: February 15, 1996Date of Patent: August 19, 1997Assignee: International Business Machines CorporationInventors: Richard Gordon Charlton, George Charles Correia, Mark Andrew Couture, Gary Ray Hill, Kibby Barth Horsford, Anthony Paul Ingraham, Michael David Lowell, Voya Rista Markovich, Gordon Charles Osborne, Jr., Mark Vincent Pierson