Abstract: A contiguous gasket provides an electromagnetic and environmental seal between the base and lid of a microcircuit housing. The base has a flat surface that allows easy access of tools for assembling electronic components. Channels are cut into a corresponding flat portion of the lid to accommodate the electronic components mounted on the base. High-frequency feedthroughs are brought through sidewall connector features of the base that rise above the assembly surface. Feedthroughs are optionally brought through the flat portion of the base as well. When the microcircuit housing is assembled, the lid compresses the gasket against the base to form an electromagnetic and environmental seal.

Abstract: Quasi-coaxial transmission lines to be “crossed” (over) are fabricated on a substrate. There are two cases: a true ground plane of metal will cover the substrate, or, each quasi-coaxial transmission line will have its own separate meandering bottom-half ground shield. In either case, when the crossed quasi-coaxial transmission lines are complete they will have top-half ground shields connected to metal against the substrate that is ground. If there is no ground plane the “crossing” quasi-coaxial transmission line that is to cross over must now have its bottom-half ground shield applied. It can overlay any top-half ground shield for any crossed quasi-coaxial transmission line that is in its path. If there is a ground plane, then that step is not necessary. Now a bottom-half layer of KQ dielectric material is applied along the path of the crossing quasi-coaxial transmission line. To this layer of KQ dielectric material is applied a layer of metal that becomes the center conductor.

Abstract: Quasi-coaxial transmission lines to be “crossed” (over) are fabricated on a substrate. There are two cases: a true ground plane of metal will cover the substrate, or, each quasi-coaxial transmission line will have its own separate meandering bottom-half ground shield. In either case, when the crossed quasi-coaxial transmission lines are complete they will have top-half ground shields connected to metal against the substrate that is ground. If there is no ground plane the “crossing” quasi-coaxial transmission line that is to cross over must now have its bottom-half ground shield applied. It can overlay any top-half ground shield for any crossed quasi-coaxial transmission line that is in its path. If there is a ground plane, then that step is not necessary. Now a bottom-half layer of KQ dielectric material is applied along the path of the crossing quasi-coaxial transmission line. To this layer of KQ dielectric material is applied a layer of metal that becomes the center conductor.

Abstract: A hybrid circuit having a quasi-coaxial fully shielded conductor, and incorporating a ground plane on the component side of a substrate, can bypass and/or filter a signal using integrated thick film components and without through holes or vias. A thin pad of suitable dielectric material may be printed onto the ground plane and then have a layer of metal deposited on its top surface, forming a bypass capacitor. The bypass capacitor can be located very near where it is needed, and only a very short conductor is required to connect the metallic top of the bypass capacitor to the location to be bypassed. The short connecting conductor does not go from one side of the substrate to the other, and the thickness and low dielectric constant of the substrate do not compromise the value of the bypass capacitor. Thick film resistors can be included to form filters, and surface mount resistors and capacitors can be used also.

Abstract: An integrated low cost thick film RF module and method for making same. An improved thick film dielectric is employed to build three-dimensional, high frequency structures. This new dielectric can be utilized to create novel RF and microwave modules that inexpensively integrate the I/O and electrical isolation functions of traditional microcircuits without using the usual set of expensive components. In particular, the module comprises a substrate; a conductive ground plane disposed above the substrate; a first dielectric layer printed on top of the ground plane; a microstrip disposed on top of the first dielectric; a second dielectric layer printed on top of the microstrip; a top ground plane disposed on top of the second dielectric; and a shield, electrically coupled to the top ground plane.

Abstract: A technique for forming imbedded microwave structures in a microwave circuit package is presented. In one method, windows are punched, stamped or molded into metal laminate plates. A metal laminate layer is formed by fusing each of the metal laminate plates one on top of another, preferably using a diffusion bonding technique. The metal laminate layer is fused on top of a metal base plate, which is adhered to a ceramic substrate, and a shielded cover is fused on top of the metal laminate layer to form the imbedded waveguide structure as the base plate, metal laminate plates, and cover plate are fused together. In another method, indented cavities are formed in a shielded cover. The shielded cover is then fused, preferably using a diffusion bonding technique, to a metal base plate, which is adhered to a ceramic substrate.