Abstract: A halogen-free flame retardant adhesive comprises an acrylic copolymer preparable by polymerization of monomers comprising a first monomer which comprises a low glass transition temperature (Tg) monomer, a second monomer which comprises a high Tg monomer, wherein at least one of the first and second monomers comprises a (meth)acrylate, and a phosphinate containing monomer.

Abstract: Flame retardant tackifiers are represented by the formula ? wherein R represents a hydrocarbyl group having 20 carbons and three consecutive fused six-membered rings; and each R2 independently represents an alkyl group having from 1 to 8 carbon atoms. Curable compositions contain a curable binder precursor and at least one of the flame resistant tackifiers. Pressure-sensitive adhesives comprises an elastomer and at least one flame retardant tackifier compound represented by the formula ? wherein R represents a hydrocarbyl group having 20 carbon atoms and three consecutive fused six-membered rings and each R1 independently represents an alkyl or aryl group having from 1 to 8 carbon atoms.

Abstract: A halogen-free flame retardant adhesive comprises an acrylic copolymer preparable by polymerization of monomers comprising a first monomer which comprises a low glass transition temperature (Tg) monomer, a second monomer which comprises a high Tg monomer, wherein at least one of the first and second monomers comprises a (meth)acrylate, and a phosphinate containing monomer.

Abstract: A halogen-free flame retardant adhesive comprises an acrylic copolymer preparable by polymerization of monomers comprising a first monomer which comprises a low glass transition temperature (Tg) monomer, a second monomer which comprises a high Tg monomer, wherein at least one of the first and second monomers comprises a (meth)acrylate, and a phosphate containing monomer.

Abstract: Flame retardant tackifiers are represented by the formula ? wherein R represents a hydrocarbyl group having 20 carbons and three consecutive fused six-membered rings; and each R2 independently represents an alkyl group having from 1 to 8 carbon atoms. Curable compositions contain a curable binder precursor and at least one of the flame resistant tackifiers. Pressure-sensitive adhesives comprises an elastomer and at least one flame retardant tackifier compound represented by the formula ? wherein R represents a hydrocarbyl group having 20 carbon atoms and three consecutive fused six-membered rings and each R1 independently represents an alkyl or aryl group having from 1 to 8 carbon atoms.

Abstract: Pressure sensitive adhesive tapes having flame retarding properties include a backing and a pressure sensitive adhesive layer. The pressure sensitive adhesive layer includes a (meth)acrylate-based block copolymer, and may also include at least 10% by weight of a halogen-free flame retarding agent. The adhesive layer may contain additional optional additives such as tackifying resins, plasticizers, and the like. The tapes are prepared by coating the flame retarding pressure sensitive adhesive onto the backing, either in solvent or by a solventless process.

Abstract: Pressure sensitive adhesives having flame retarding properties include a (meth)acrylate-based block copolymer, and at least 10% by weight of a halogen-free flame retarding agent. The adhesives may contain additional optional additives such as tackifying resins, plasticizers, and the like. The adhesives are prepared by blending the (meth)acrylate-based block copolymer, and the halogen-free flame retarding agent either in solvent or by a solventless process.

Abstract: Pressure sensitive adhesives containing a cyclic phosphonate ester are described. Methods of preparing such adhesives and articles comprising such adhesives are also described.

Abstract: A filament guide comprises a support tube having an internal wall defining an axial channel to receive a length of a filament. The axial channel provides containment for a filament closure, surrounding at least a portion of the filament and in contact with at least a portion of the internal wall. The filament closure includes a portion of frozen fluid, such as water that provides an ice bearing including an orifice to allow movement of the length of the filament through the filament closure. Suitable filaments include non-conducting filaments especially optical fibers.

Abstract: A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexible circuit facing toward the stiffener but separated therefrom by the adhesive. The conductive traces include an array of flip-chip attachment pads. A window is formed in the stiffener over the attachment pad array, such as by etching. The adhesive is then removed over the attachment pads by laser ablation, but left in place between the pads, thus forming a flip-chip attachment site. In preferred embodiments, this invention eliminates the need for high-resolution patterned adhesive, and it also eliminates the need for application of a solder mask at the flip-chip attachment site, because the remaining adhesive performs the solder mask function of preventing bridging between attachment pads.

Abstract: A low-cost integrated circuit package is provided for packaging integrated circuits. In preferred embodiments, the package comprises a flexible circuit that is laminated to a stiffener using a dielectric adhesive, with the conductive traces on the flexible circuit facing toward the stiffener but separated therefrom by the adhesive. The conductive traces include an array of flip-chip attachment pads. A window is formed in the stiffener over the attachment pad array, such as by etching. The adhesive is then removed over the attachment pads by laser ablation, but left in place between the pads, thus forming a flip-chip attachment site. In preferred embodiments, this invention eliminates the need for high-resolution patterned adhesive, and it also eliminates the need for application of a solder mask at the flip-chip attachment site, because the remaining adhesive performs the solder mask function of preventing bridging between attachment pads.

Abstract: A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is conventional. This construction allows the elimination of a previously necessary solder mask and so reduces the cost to produce the package.

Abstract: A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.

Abstract: A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.