Patents by Inventor Anthony Silveira

Anthony Silveira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Communication to under-served areas using communication enabled vehicles
    Patent number: 11451980
    Abstract: A mobile receiving vehicle may be directed to cover an area to maximize the communication opportunities for mobile computing devices. The demands on the mobile receiving vehicles may change over time and the mobile receiving vehicles may move according to a plan to maximize network access.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: September 20, 2022
    Assignee: T-MOBILE USA, INC.
    Inventor: Anthony Silveira
  • COMMUNICATION TO UNDER-SERVED AREAS USING COMMUNICATION ENABLED VEHICLES
    Publication number: 20210409971
    Abstract: A mobile receiving vehicle may be directed to cover an area to maximize the communication opportunities for mobile computing devices. The demands on the mobile receiving vehicles may change over time and the mobile receiving vehicles may move according to a plan to maximize network access.
    Type: Application
    Filed: June 24, 2020
    Publication date: December 30, 2021
    Inventor: Anthony Silveira
  • Inorganic lift-off profile process for semiconductor wafer processing
    Patent number: 10438848
    Abstract: An Inorganic Lift-Off-Profile-Process (referred to herein as “ILOPP”) is described wherein a portion of a surface inorganic oxide is etched from a substrate oxide surface and under a photoresist edge that supports a sacrificial metal layer. This oxide etched profile under the sacrificial photoresist/metal edge improves Lift-Off of the sacrificial metal layer and delivers smoother, improved metal edge definition in addition to an improved planer surface (flatness) as compared to known LOP technologies.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: October 8, 2019
    Assignee: Semi Automation & Technologies, Inc.
    Inventors: Leon Benton Pearce, Glenn Anthony Silveira
  • Inorganic Lift-Off Profile Process For Semiconductor Wafer Processing
    Publication number: 20190131168
    Abstract: An Inorganic Lift-Off-Profile-Process (referred to herein as “ILOPP”) is described wherein a portion of a surface inorganic oxide is etched from a substrate oxide surface and under a photoresist edge that supports a sacrificial metal layer. This oxide etched profile under the sacrificial photoresist/metal edge improves Lift-Off of the sacrificial metal layer and delivers smoother, improved metal edge definition in addition to an improved planer surface (flatness) as compared to known LOP technologies.
    Type: Application
    Filed: October 31, 2018
    Publication date: May 2, 2019
    Inventors: Leon Benton Pearce, Glenn Anthony Silveira