Abstract: An automated cryogenic storage system includes a freezer and an automation system to provide automated transfer of samples to and from the freezer. The freezer includes a bearing and a drive shaft though the freezer, the drive shaft being coupled to a rack carrier inside the freezer and adapted to be coupled to a motor. The automation module includes a rack puller that is automatically positioned above an access port of the freezer. The rack puller engages with a sample rack within the freezer, and elevates the rack into an insulating sleeve external to the freezer. From the insulating sleeve, samples can be added to and removed from the sample rack before it is returned to the freezer.

Abstract: A method of forming an erosion shield for a turbine blade includes depositing a layer of filler material defining an upper surface. The method also includes depositing a layer of erosion-resistant material across the upper surface of the layer of filler material. An interface is defined between the layer of filler material and the layer of erosion-resistant material and has a shape of the upper surface. The method also includes machining the layer of filler material to produce the erosion shield. The erosion shield has the layer of erosion-resistant material, the machined layer of filler material, and the interface defined therebetween. An inner surface of the erosion shield is defined by the machined layer of filler material that is sized and shaped for attaching to a leading edge of the turbine blade. Each of the interface and the inner surface extend a length of the erosion shield.

Abstract: An electrical box assembly for adjustable-depth mounting of an electrical box relative to a support structure. The electrical box assembly can include a centerplate with a centerplate opening and an electrical box with an electrical box housing, a back plate removably attached to the electrical box housing, and an extendable sleeve configured to receive fasteners of electrical devices. The electrical box can be received within the centerplate opening, with the electrical box housing secured to the centerplate. The extendable sleeve can be selectively slidable within the electrical box housing.

Abstract: An additive manufacturing (AM) system, comprises an adjustable base; a build platform including a peripheral region and a periphery of the peripheral region, the periphery being fixedly and rigidly coupled to the base and a middle region, wherein a metallurgical connection fixedly and rigidly couples the periphery of the peripheral region to the base; and a build material applicator for depositing a build material above the build platform for creating an object.

Abstract: Techniques are described for detecting counterfeit products by identifying differences between hardware components and orientations of the counterfeit products, and hardware components and orientations of authentic products. In some examples, the hardware components and orientations can be identified by generating hardware intrinsic development data based on telemetry data of products (or “devices”). By way of example, the telemetry data may be analyzed by machine learning (ML) models to generate representative models of the hardware intrinsic development data. In various examples, the representative models can include sample representative models of hardware intrinsic development data generated based on valid telemetry data of authentic devices. In those or other examples, the representative models can include other representative models (or “test representative models”) of hardware intrinsic development data generated based on unvalidated telemetry data of test devices.

Abstract: Methods for manufacturing dual phase soft magnetic components include combining a plurality of soft ferromagnetic particles with a plurality of paramagnetic particles to form a component structure, wherein the plurality of soft ferromagnetic particles each comprise an electrically insulative coating, and, heat treating the component structure to consolidate the plurality of soft ferromagnetic particles with the plurality of paramagnetic particles.

Abstract: A system and method for routing communication to a common audio output device connected to each of two or more audio signal source devices. For each of the two or more audio signal source devices, a set of inputs are assessed. The set of inputs include: an operational state of the audio signal source device, an activity the audio signal source device, an audio-producing application being executed by the audio signal source device, and a degree of user activity with the audio-producing application being executed by the audio signal source. At a point in time, an audio routing score is generated for each of the two or more audio signal source devices according to a weighted calculation of the set of inputs based on the assessing. Finally, an audio signal routing decision is made, to route an audio signal from one of the two or more audio signal source devices to the audio output device, based on the audio routing score for each of the two or more audio signal source devices.

Abstract: A fluorescence-based analytical platform comprising methods, software and instrumentation that accomplishes direct, rapid, high throughput, multiplex, and quantitative determinations of virion populations, in human or animals or experimental fluids, that are impacted by, or escape from, interactions with antiviral drugs. The platform can be used to advance bnAb resistance detection capacities to support numerous bnAb clinical trial activities, from screening volunteers to tailoring subject-specific bnAb combinations for treatment or cure.

Abstract: A mounting bracket for an electrical box can be configured for use with a support that has a first and a second rail. The mounting bracket can include a first attachment device that is secured to mounting body and a second attachment device that is secured to the mounting body opposite the first attachment device. To secure the mounting bracket to the support, the first attachment device can be configured to engage one of the first rail or the second rail and the second attachment device can be configured to engage the other of the first rail or the second rail. Each of the first and second attachment devices can include a first arm configured to extend on a first side of the corresponding first or second rail, and a second arm configured to extend on a second side of the corresponding rail, opposite the first arm.

Abstract: An automated cryogenic storage system includes a freezer and an automation system to provide automated transfer of samples to and from the freezer. The freezer includes a bearing and a drive shaft though the freezer, the drive shaft being coupled to a rack carrier inside the freezer and adapted to be coupled to a motor. The automation module includes a rack puller that is automatically positioned above an access port of the freezer. The rack puller engages with a sample rack within the freezer, and elevates the rack into an insulating sleeve external to the freezer. From the insulating sleeve, samples can be added to and removed from the sample rack before it is returned to the freezer.

Abstract: Aspects of this disclosure relate to forming clusters of user equipments and network nodes. A first cluster of first user equipments and first network nodes in a first section can be formed for a time slot. A second cluster of second user equipments and second network nodes in a second section can be formed for the time slot such that the first user equipments are protected from interference associated with the second cluster. During the time slot, the first section has higher priority than the second section. Multiple-input multiple-output wireless communications can occur during the time slot (a) from the first network nodes to the first user equipments and (b) from the second network nodes to the second user equipments.

Abstract: A system includes: an objective lens; a first light source to feed first illuminating light through the objective lens and into a flowcell (e.g., with a relatively thin film waveguide) to be installed in the system, the first illuminating light to be fed using a first grating on the flowcell; and a first image sensor to capture imaging light using the objective lens, wherein the first grating is positioned outside a field of view of the first image sensor. Dual-surface imaging can be performed. Flowcells with multiple swaths bounded by gratings can be used. An auto-alignment process can be performed.

Abstract: An optical sensor packaging system and method can include: providing a substrate, the substrate including a redistribution pad; mounting an optical sensor to the substrate, the optical sensor including a photo sensitive material formed on a photo sensitive area of an active optical side of the optical sensor; wire-bonding the optical sensor to the substrate with a first bond wire connected from the active optical side to the redistribution pad; and encapsulating the optical sensor, the first bond wire, and the photo sensitive material with an over-mold, the over-mold formed with a top surface co-planar to a surface of the photo sensitive material, the over-mold forming a vertically extended border around the photo sensitive material and around the photo sensitive area, and the over-mold formed above the first bond wire.

Abstract: An optical sensor packaging system and method can include: providing a substrate, the substrate including a redistribution pad; mounting an optical sensor to the substrate, the optical sensor including a photo sensitive material formed on a photo sensitive area of an active optical side of the optical sensor; wire-bonding the optical sensor to the substrate with a first bond wire connected from the active optical side to the redistribution pad; and encapsulating the optical sensor, the first bond wire, and the photo sensitive material with an over-mold, the over-mold formed with a top surface co-planar to a surface of the photo sensitive material, the over-mold forming a vertically extended border around the photo sensitive material and around the photo sensitive area, and the over-mold formed above the first bond wire.

Abstract: An optical sensor packaging system and method can include: providing an embedded substrate, the embedded substrate including an embedded chip coupled to a redistribution pad with a redistribution line connecting therebetween; mounting an optical sensor to the embedded substrate, the optical sensor including a photo sensitive material formed on a photo sensitive area of an active optical side of the optical sensor; wire-bonding the optical sensor to the embedded substrate with a first bond wire connected from the active optical side to the redistribution pad; and encapsulating the optical sensor, the first bond wire, and the photo sensitive material with an over-mold, the over-mold formed with a top surface co-planar to a surface of the photo sensitive material, the over-mold forming a vertically extended boarder around the photo sensitive material and around the optical sensing area, and the over-mold formed above the first bond wire.

Abstract: An optical sensor packaging system and method can include: providing an embedded substrate, the embedded substrate including an embedded chip coupled to a redistribution pad with a redistribution line connecting therebetween; mounting an optical sensor to the embedded substrate, the optical sensor including a photo sensitive material formed on a photo sensitive area of an active optical side of the optical sensor; wire-bonding the optical sensor to the embedded substrate with a first bond wire connected from the active optical side to the redistribution pad; and encapsulating the optical sensor, the first bond wire, and the photo sensitive material with an over-mold, the over-mold formed with a top surface co-planar to a surface of the photo sensitive material, the over-mold forming a vertically extended boarder around the photo sensitive material and around the optical sensing area, and the over-mold formed above the first bond wire.

Abstract: A structural member for use in semiconductor packaging is disclosed. The structural member includes a plurality of packaging regions to facilitate packaging dies in, for example, a wafer format. A packaging region has a die attach region surrounded by a peripheral region. A die is attached to the die attach region. In one aspect, the die attach region has opening through the surfaces of the structural member for accommodating a die. Through-vias disposed are in the peripheral regions. The structural member reduces warpage that can occur during curing of the mold compound used in encapsulating the dies. In another aspect, the die attach region does not have an opening. In such cases, the structural member serves as an interposer between the die and a substrate.

Abstract: A wafer level package includes a wafer, a lead disposed of the wafer for connecting the wafer to an electrical circuit, and a core disposed of the lead. In some embodiments, the lead disposed of the wafer is a copper pillar, and the core is plated onto the copper pillar. In some embodiments, the core is polymer screen-plated onto the lead. In some embodiments, the core extends between at least approximately thirty-five micrometers (35 ?m) and fifty micrometers (50 ?m) from the lead. In some embodiments, the core covers between at least approximately one-third (?) and one-half (½) of the surface area of the lead. In some embodiments, the core comprises a stud-shape extending from the lead. In some embodiments, the core extends perpendicularly across the lead. In some embodiments, the core extends longitudinally along the lead. Further, a portion of the core can extend perpendicularly from a longitudinal core.

Abstract: Wafer-level package devices are described that include multiple die packaged into a single wafer-level package device. In an implementation, a wafer-level package device includes a semiconductor device having at least one electrical interconnection formed therein. At least one semiconductor package device is positioned over the first surface of the semiconductor device. The semiconductor package device includes one or more micro-solder bumps. The wafer-level package device further includes an encapsulation structure disposed over and supported by the semiconductor device for encapsulating the semiconductor package device(s). When the semiconductor package device is positioned over the semiconductor device, each micro-solder bump is connected to a respective electrical interconnection that is formed in the semiconductor device.