Abstract: In particular embodiments, an energy gateway is described that is configured to receive power usage information from one or more power meters, transmit the power usage information to an energy management server, receive control signals from the energy management server, transmit the control signals to the one or more power switches and execute localized pre-programmed rules.

Abstract: In particular embodiments, an energy gateway is described that is configured to receive power usage information from one or more power meters, transmit the power usage information to an energy management server, receive control signals from the energy management server, transmit the control signals to the one or more power switches and execute localized pre-programmed rules.

Abstract: In particular embodiments, an energy gateway is described that is configured to receive power usage information from one or more power meters, transmit the power usage information to an energy management server, receive control signals from the energy management server, transmit the control signals to the one or more power switches and execute localized pre-programmed rules.

Abstract: Methods, devices and kits for treating sleep disorders, anxiety disorders, and developmental disorders, and/or for inducing an arousable state of sedation in a subject, are described. For example, inhalation methods, devices and kits for treating insomnia, anxiety and/or ADHD using one or more ?2-adrenergic agonists such as dexmedetomidine or clonidine are described.

Abstract: In particular embodiments, an energy gateway is described that is configured to receive power usage information from one or more power meters, transmit the power usage information to an energy management server, receive control signals from the energy management server, transmit the control signals to the one or more power switches and execute localized pre-programmed rules.

Abstract: A projection system, a spatial light modulator, and a method for forming a MEMS device is disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micromirror array. The two substrates can be bonded at the wafer level after depositing a getter material and/or solid or liquid lubricant on one or both of the wafers. The wafers can be bonded together hermetically if desired, and the pressure between the two substrates can be below atmosphere.

Abstract: A method of manufacturing a lead frame includes providing an electrically conductive layer having a plurality of holes at a top surface. The plurality of holes form a structure of leads and a die pad on the electrically conductive layer. The plurality of holes are filled with a non-conductive material. Next; an electrically conductive foil is attached on the top surface of the electrically conductive layer and the non-conductive epoxy material. Then, the electrically conductive foil is etched to create a network of leads, die pad, bus lines, dam bars and tie lines, wherein the bus lines connect the leads to the dam bar, the dam bar is connected to the tie line and the tie line is connected to the die pad.

Abstract: A stacked die semiconductor package that includes a substrate with a plurality of adhesive portions arranged in a manner to create at least one gap between the adhesive portions. The package also includes a first semiconductor chip having a non-active surface in contact with the adhesive portions, and an active surface being electrically connected to the substrate. In the package, a second semiconductor chip the non-active surface of the second semiconductor chip is attached to the non-active surface of the first semiconductor chip by a layer of adhesive therebetween. The active surface of the second semiconductor chip is electrically connected to the substrate. An encapsulant material covers the first and second semiconductor chips and their associated electrical connections. The encapsulating material fills the at least one gap between the plurality of adhesive portions and thereby encapsulates the second semiconductor chip and its associated electrical connection.

Abstract: A projection system, a spatial light modulator, and a method for forming a MEMS device is disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micromirror array. The two substrates can be bonded at the wafer level after depositing a getter material andlor solid or liquid lubricant on one or both of the wafers. The wafers can be bonded together hermetically if desired, and the pressure between the two substrates can be below atmosphere.

Abstract: A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an edge of the package. Also, the outer ends of the first leads form a first row along the edge of the package and the outer ends of the second leads form a second row along the edge of the package. In one embodiment, the first and second rows are parallel to each other and an encapsulant covers at least a portion of the first and second leads.

Abstract: An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die pad having a first face and a second face opposite to the first face. The second face of the die pad is orthogonally offset from the second face of the leads so that the second face of the die pad and the second face of the leads are not coplanar. The package also comprises an integrated circuit chip substantially laterally disposed between the plurality of leads, and having a first face and a second face opposite to the first face. The first face of the integrated circuit chip is proximate to the second face of the die pad and the first face of the integrated circuit chip is coupled to the second face of the die pad. The package further comprises a plurality of wires that link the plurality of leads to the integrated circuit chip.

Abstract: A thermally enhanced ball grid array package is disclosed. The package includes a base layer element and a flip chip die mounted on the base layer element. The die has a first surface electrically coupled to the base layer element, a second surface opposite to the first surface, and lateral sides. A molding compound encapsulates the base layer element and the lateral sides of the die. A surface is formed of the second surface of the die and an upper surface of the molding compound. A material is disposed on the surface, and a heat spreader is mounted on the material.

Abstract: A projection system, a spatial light modulator, and a method for forming a MEMS device is disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micromirror array. The two substrates can be bonded at the wafer level after depositing a getter material andlor solid or liquid lubricant on one or both of the wafers. The wafers can be bonded together hermetically if desired, and the pressure between the two substrates can be below atmosphere.