Patents by Inventor Anthony Swanson

Anthony Swanson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microforming method and apparatus
    Patent number: 8408039
    Abstract: Method of forming depressions (e.g. dimples) in a sheet material to form a textured surface thereon involves pressing one or more tool tips into a metallic or non-metallic sheet material while the sheet material is supported by a support layer that is relatively softer (e.g. having a lower Young's modulus) than the sheet material so as to allow plastic deformation and reduce pile-up of raised displaced material of the sheet material at the edges of the depressions.
    Type: Grant
    Filed: October 6, 2009
    Date of Patent: April 2, 2013
    Assignee: Northwestern University
    Inventors: Jian Cao, Anthony Swanson, Tiffany Davis
  • Microforming method and apparatus
    Publication number: 20100092796
    Abstract: Method of forming depressions (e.g. dimples) in a sheet material to form a textured surface thereon involves pressing one or more tool tips into a metallic or non-metallic sheet material while the sheet material is supported by a support layer that is relatively softer (e.g. having a lower Young's modulus) than the sheet material so as to allow plastic deformation and reduce pile-up of raised displaced material of the sheet material at the edges of the depressions.
    Type: Application
    Filed: October 6, 2009
    Publication date: April 15, 2010
    Inventors: Jian Cao, Anthony Swanson, Tiffany Davis