Abstract: Embodiments generally relate to methods for preventing the formation of an emulsion in a liquid lens. In one embodiment, the method comprises fabricating a top substrate, a bottom s substrate, and a central substrate including a cavity configured to be filled by first and second liquids. The liquid lens comprising the top substrate, the bottom substrate and the central substrate is assembled, with at least one of the top substrate and the bottom substrate in the assembled liquid lens being characterized by a stabilizing feature determining that in response to an impact load on the assembled liquid lens that would cause localized pressure drops of 10 maximum magnitude X in the absence of the stabilizing feature, the maximum magnitude of localized pressure drops within the liquid lens is smaller than X.

Abstract: Embodiments generally relate to chips containing one or more hermetically sealed chambers that may be dismantled under controlled conditions using a release technique. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

Abstract: Embodiments generally relate to apparatus and methods for dismantling a hermetically sealed chamber. In one embodiment, an apparatus facilitating the opening of a hermetically sealed chamber in a device comprises a fixture configured to hold the device, and a system configured to create sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. In one embodiment, a method for opening a hermetic seal between first and second elements forming a chamber in a microfluidic chip comprises using a release technique creating sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. The release technique comprises introducing a tool to the vicinity of the interface without any contact between the tool and any material within the chamber. The breaking of the seal results in the complete separation of the first and second elements.

Abstract: Embodiments generally relate to apparatus and methods for dismantling a hermetically sealed chamber. In one embodiment, an apparatus facilitating the opening of a hermetically sealed chamber in a device comprises a fixture configured to hold the device, and a system configured to create sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. In one embodiment, a method for opening a hermetic seal between first and second elements forming a chamber in a microfluidic chip comprises using a release technique creating sufficient tensile or shear stress at a bond interface of the seal to open the seal under controlled conditions. The release technique comprises introducing a tool to the vicinity of the interface without any contact between the tool and any material within the chamber. The breaking of the seal results in the complete separation of the first and second elements.

Abstract: Embodiments generally relate to chips containing one or more hermetically sealed chambers that may be dismantled under controlled conditions using a release technique. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

Abstract: Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.

Abstract: Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.