Abstract: An optical apparatus (10) for routing an optical signal (12) comprises a body (14) comprising a material. A waveguide (16) is formed in the body (14) by laser modification of the material. The optical apparatus (10) further comprises a region (18) comprising a lower refractive index than the material of the body (14) and defines an interface (24) between the region (18) and the waveguide (16). The waveguide (16) and the interface (24) are aligned relative to each other for routing the optical signal (12) therebetween and reflecting the optical signal (12) at the interface (24).

Abstract: Optical apparatus and methods of manufacture thereof An optical apparatus (20) for evanescently coupling an optical signal across an (interface (30) is described. The optical apparatus (20) comprises a first substrate (22) and a second substrate (24). The optical signal is evanescently coupled between a first waveguide (26) formed by laser inscription of the first substrate (22) and a second waveguide (28) of the second substrate (22). The first waveguide (26) comprises a curved section (34) configured to provide evanescent coupling of the optical signal between the first and second waveguides (26, 28) via the interface (30).

Abstract: Optical apparatus and methods of manufacture thereof An optical apparatus (20) for evanescently coupling an optical signal across an (interface (30) is described. The optical apparatus (20) comprises a first substrate (22) and a second substrate (24). The optical signal is evanescently coupled between a first waveguide (26) formed by laser inscription of the first substrate (22) and a second waveguide (28) of the second substrate (22). The first waveguide (26) comprises a curved section (34) configured to provide evanescent coupling of the optical signal between the first and second waveguides (26, 28) via the interface (30).

Abstract: An optical apparatus (10) for routing an optical signal (12) comprises a body (14) comprising a material. A waveguide (16) is formed in the body (14) by laser modification of the material. The optical apparatus (10) further comprises a region (18) comprising a lower refractive index than the material of the body (14) and defines an interface (24) between the region (18) and the waveguide (16). The waveguide (16) and the interface (24) are aligned relative to each other for routing the optical signal (12) therebetween and reflecting the optical signal (12) at the interface (24).

Abstract: An optical apparatus 20 for evanescently coupling an optical signal across an interface 30 is described. The optical apparatus 20 comprises a first substrate 22 and a second substrate 24. The optical signal is evanescently coupled between a first waveguide 26 formed by laser inscription of the first substrate 22 and a second waveguide 28 of the second substrate 22. The first waveguide 26 comprises a curved section 34 configured to provide evanescent coupling of the optical signal between the first and second waveguides 26, 28 via the interface 30.

Abstract: An optical apparatus 20 for evanescently coupling an optical signal across an interface 30 is described. The optical apparatus 20 comprises a first substrate 22 and a second substrate 24. The optical signal is evanescently coupled between a first waveguide 26 formed by laser inscription of the first substrate 22 and a second waveguide 28 of the second substrate 22. The first waveguide 26 comprises a curved section 34 configured to provide evanescent coupling of the optical signal between the first and second waveguides 26, 28 via the interface 30.

Abstract: A method of fabricating a micro-electrical-mechanical system (MEMS) apparatus on a substrate comprises the steps of processing the substrate so as to fabricate an electronic circuit; depositing a first electrode that is operably coupled with the electronic circuit; depositing a membrane so that it is mechanically coupled to the first electrode; applying a sacrificial layer; depositing a structural layer and a second electrode that is operably coupled with the electronic circuit so that the sacrificial layer is disposed between the membrane and the structural layer so as to form a preliminary structure; singulating the substrate; and removing the sacrificial layer so as to form a MEMS structure, in which the step of singulating the substrate is carried out before the step of removing the sacrificial layer.

Abstract: A method of fabricating a micro-electrical-mechanical system (MEMS) apparatus on a substrate (10) comprises the steps of processing the substrate (10) so as to fabricate an electronic circuit (11); depositing a first electrode (15) that is operably coupled with the electronic circuit (11); depositing a membrane (16) so that it is mechanically coupled to the first electrode (15); applying a sacrificial layer (50); depositing a structural layer (18) and a second electrode (17) that is operably coupled with the electronic circuit (11) so that the sacrificial layer (50) is disposed between the membrane (16) and the structural layer (18) so as to form a preliminary structure; singulating the substrate (10); and removing the sacrificial layer (50) so as to form a MEMS structure, in which the step of singulating the substrate (10) is carried out before the step of removing the sacrificial layer (50).

Abstract: A MEMS device comprising a flexible membrane that is free to move in response to pressure differences generated by sound waves. A first electrode mechanically coupled to the flexible membrane, and together form a first capacitive plate. A second electrode mechanically coupled to a generally rigid structural layer or back-plate, which together form a second capacitive plate. A back-volume is provided below the membrane. A first cavity located directly below the membrane. Interposed between the first and second electrodes is a second cavity. A plurality of bleed holes connected the first cavity and the second cavity. Acoustic holes are arranged in the back-plate so as to allow free movement of air molecules, such that the sound waves can enter the second cavity. The first and second cavities in association with the back-volume allow the membrane to move in response to the sound waves entering via the acoustic holes in the back-plate.

Abstract: A MEMS device comprising a flexible membrane that is free to move in response to pressure differences generated by sound waves. A first electrode mechanically coupled to the flexible membrane, and together form a first capacitive plate. A second electrode mechanically coupled to a generally rigid structural layer or back-plate, which together form a second capacitive plate. A back-volume is provided below the membrane. A first cavity located directly below the membrane. Interposed between the first and second electrodes is a second cavity. A plurality of bleed holes connect the first cavity and the second cavity. Acoustic holes are arranged in the back-plate so as to allow free movement of air molecules, such that the sound waves can enter the second cavity. The first and second cavities in association with the back-volume allow the membrane to move in response to the sound waves entering via the acoustic holes in the back-plate.

Abstract: A MEMS device, for example a capacitive microphone, comprises a flexible membrane 11 that is free to move in response to pressure differences generated by sound waves. A first electrode 13 is mechanically coupled to the flexible membrane 11, and together form a first capacitive plate of the capacitive microphone device. A second electrode 23 is mechanically coupled to a generally rigid structural layer or back-plate 14, which together form a second capacitive plate of the capacitive microphone device. The capacitive microphone is formed on a substrate 1, for example a silicon wafer. A back-volume 33 is provided below the membrane 11, and is formed using a “back-etch” through the substrate 1. A first cavity 9 is located directly below the membrane 11, and is formed using a first sacrificial layer during the fabrication process. Interposed between the first and second electrodes 13 and 23 is a second cavity 17, which is formed using a second sacrificial layer during the fabrication process.

Abstract: A method of fabricating a micro-electrical-mechanical system (MEMS) apparatus on a substrate (10) comprises the steps of processing the substrate (10) so as to fabricate an electronic circuit (11); depositing a first electrode (15) that is operably coupled with the electronic circuit (11); depositing a membrane (16) so that it is mechanically coupled to the first electrode (15); applying a sacrificial layer (50); depositing a structural layer (18) and a second electrode (17) that is operably coupled with the electronic circuit (11) so that the sacrificial layer (50) is disposed between the membrane (16) and the structural layer (18) so as to form a preliminary structure; singulating the substrate (10); and removing the sacrificial layer (50) so as to form a MEMS structure, in which the step of singulating the substrate (10) is carried out before the step of removing the sacrificial layer (50).

Abstract: A MEMS device, for example a capacitive microphone, comprises a flexible membrane 11 that is free to move in response to pressure differences generated by sound waves. A first electrode 13 is mechanically coupled to the flexible membrane 11, and together form a first capacitive plate of the capacitive microphone device. A second electrode 23 is mechanically coupled to a generally rigid structural layer or back-plate 14, which together form a second capacitive plate of the capacitive microphone device. The capacitive microphone is formed on a substrate 1, for example a silicon wafer. A back-volume 33 is provided below the membrane 11, and is formed using a “back-etch” through the substrate 1. A first cavity 9 is located directly below the membrane 11, and is formed using a first sacrificial layer during the fabrication process. Interposed between the first and second electrodes 13 and 23 is a second cavity 17, which is formed using a second sacrificial layer during the fabrication process.