Patents by Inventor Anthony W. Beyer

Anthony W. Beyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6109445
    Abstract: A modular tray system for holding component carriers includes a rectangular frame having retaining elements in the form of slots or pegs along opposite sides. Rails or partitions are arranged in parallel and selectively spaced apart along the opposite sides, and spaced apart along the opposite sides, and spanning between the opposite sides. Component carriers such as strips of thermoformed component-holding carrier tape are supported on the spaced apart rails. The modules can be stacked to allow for the holding of component carriers having relatively deep component-holding pockets.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: August 29, 2000
    Assignee: Tek Pak, Inc.
    Inventor: Anthony W. Beyer
  • Patent number: 6042046
    Abstract: A device for unreeling and/or reeling spools of material. The device has a horizontal frame assembly formed of a drawbar and a cantilever frame wherein the drawbar is for connection to a vehicle; a vertical frame that is affixed to the horizontal frame and for connection to a vehicle; a rotatable shaft pivotally attached to the horizontal frame, dimensioned for receiving a spool of material thereover, and having a base for supporting the spool of material near the pivot end; and a winch or cylinder for lowering the shaft from an upright to a horizontal position and for selectively raising the shaft.
    Type: Grant
    Filed: August 13, 1997
    Date of Patent: March 28, 2000
    Inventor: Anthony W. Beyer, Sr.
  • Patent number: 6003676
    Abstract: A carrier tape formed with a plurality of product receiving pockets molded therein. Pocket detail is formed by moving a male mold element and the carrier tape relatively toward one another thereby causing a respective region of the tape to conform to the shape of the mold element. Fluid pressure can be used to drive the carrier tape further into conformity with the shape of the respective mold element. A vacuum channel can be provided in the mold element to reduce the pressure on the side of the tape adjacent to the mold thereby increasing the pressure differential across the tape. Both multi-station linear and rotary molds carrying male molding surfaces can be used to increase throughput. Product positioning surfaces, formed on the male mold elements can be imparted to the interior of the formed pockets along with light diffusing patterns to provide improved performance by scanning or optical monitoring systems.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: December 21, 1999
    Assignee: Tek Pak, Inc.
    Inventor: Anthony W. Beyer