Patents by Inventor Anthony Yeh Chiing Wong

Anthony Yeh Chiing Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Active thermal control using a burn-in socket heating element
    Patent number: 7701238
    Abstract: In one embodiment, the present invention includes a burn-socket for insertion into a test board, where the burn-in socket is coupled to receive a semiconductor device under test (DUT). The burn-in socket includes a substrate to support the semiconductor DUT, which includes a heating element embedded in a layer of the substrate. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: April 20, 2010
    Assignee: Intel Corporation
    Inventors: Anthony Yeh Chiing Wong, Victor Henckel, Boon Liang Heng, Christopher Wade Ackerman, James C. Shipley
  • Active thermal control using a burn-in socket heating element
    Publication number: 20090002010
    Abstract: In one embodiment, the present invention includes a burn-socket for insertion into a test board, where the burn-in socket is coupled to receive a semiconductor device under test (DUT). The burn-in socket includes a substrate to support the semiconductor DUT, which includes a heating element embedded in a layer of the substrate. Other embodiments are described and claimed.
    Type: Application
    Filed: June 26, 2007
    Publication date: January 1, 2009
    Inventors: Anthony Yeh Chiing Wong, Victor Henckel, Boon Liang Heng, Christopher Wade Ackerman, James C. Shipley
  • Actively controlled embedded burn-in board thermal heaters
    Publication number: 20080302783
    Abstract: In one embodiment, a test board includes a plurality of socket locations each to receive a corresponding burn-in socket which in turn is to receive a semiconductor device under test (DUT). Each of the socket locations includes a heating element embedded within the test board, which may be used to provide thermal conduction to the DUT during a burn-in test. Other embodiments are described and claimed.
    Type: Application
    Filed: June 8, 2007
    Publication date: December 11, 2008
    Inventors: Anthony Yeh Chiing Wong, Christopher Wade Ackerman, James C. Shipley, Hon Lee Kon