Abstract: A semiconductor stack, including a carrier and a semiconductor device arranged above the carrier; non-releasable interconnections electrically and mechanically connecting the semiconductor device and the carrier; a first contact on at least one of the carrier or the semiconductor device: a second contact on at least one of the carrier or the semiconductor device; an electrical connection structure electrically conductively coupling the first contact and the second contact with each other via at least one non-releasable interconnection of the non-releasable interconnections; and wherein the electrical connection structure comprises a plurality of test diode circuits integrated in at least one of the carrier and the semiconductor device, wherein each of the test diode circuits comprises one or more diodes.

Abstract: Systems and methods are presented for power supply noise cancellation in a microphone package. A first node on a MEMS microphone package is coupled to an inverted voltage signal of a power supply output. A summing node is connected to both the first node and a second node. The second node is coupled to a non-inverted voltage signal of the power supply output. Because the parasitic capacitance of the MEMS microphone package is substantially equivalent relative to both the first node and the second node, the summing node outputs a noise-reduced summed voltage signal. An adjustable trim module is coupled to the first node and configured to adjust a reduction of a power supply noise in the summed voltage signal from the summing node.

Abstract: Systems and methods are presented for power supply noise cancellation in a microphone package. A first node on a MEMS microphone package is coupled to an inverted voltage signal of a power supply output. A summing node is connected to both the first node and a second node. The second node is coupled to a non-inverted voltage signal of the power supply output. Because the parasitic capacitance of the MEMS microphone package is substantially equivalent relative to both the first node and the second node, the summing node outputs a noise-reduced summed voltage signal. An adjustable trim module is coupled to the first node and configured to adjust a reduction of a power supply noise in the summed voltage signal from the summing node.

Abstract: A MEMS microphone package is described that includes a first node and a second node having nearly equivalent 3D parasitic capacitances relative to a preamplifier of the microphone package, such that any noise generated on the first node is equivalent to any noise generated on the second node. An external power supply is connected to the first node and provides a bias voltage signal to the MEMS microphone package via the first node. An inverting amplifier is connected between the power supply and the second node. A third node is connected to the first node through a packaging parasitic capacitor, while the second node is connected to the third node through either an intended parasitic capacitor or an explicit capacitor. The noise coupled from the external power supply to the third node is then cancelled by summing the inverted power supply noise into the third node.

Abstract: A MEMS microphone package is described that includes a first node and a second node having nearly equivalent 3D parasitic capacitances relative to a preamplifier of the microphone package, such that any noise generated on the first node is equivalent to any noise generated on the second node. An external power supply is connected to the first node and provides a bias voltage signal to the MEMS microphone package via the first node. An inverting amplifier is connected between the power supply and the second node. A third node is connected to the first node through a packaging parasitic capacitor, while the second node is connected to the third node through either an intended parasitic capacitor or an explicit capacitor. The noise coupled from the external power supply to the third node is then cancelled by summing the inverted power supply noise into the third node.